参数资料
型号: TPA3120D2PWPRG4
厂商: TEXAS INSTRUMENTS INC
元件分类: 音频/视频放大
英文描述: 20 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24
封装: GREEN, PLASTIC, HTSSOP-24
文件页数: 9/29页
文件大小: 952K
代理商: TPA3120D2PWPRG4
www.ti.com
THERMAL PROTECTION
PRINTED-CIRCUIT BOARD (PCB) LAYOUT
SLOS507E – MARCH 2007 – REVISED SEPTEMBER 2007
Thermal protection on the TPA3120D2 prevents damage to the device when the internal die temperature
exceeds 150
°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. This is not
a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 30
°C. The device
begins normal operation at this point with no external system interaction.
Because the TPA3120D2 is a class-D amplifier that switches at a high frequency, the layout of the printed-circuit
board (PCB) should be optimized according to the following guidelines for the best possible performance.
Decoupling capacitors—The high-frequency 0.1-μF decoupling capacitors should be placed as close to the
PVCC (pins 1, 3, 10, and 12) and AVCC (pins 19 and 20) terminals as possible. The VBYP (pin 7) capacitor
and VCLAMP (pin 11) capacitor should also be placed as close to the device as possible. Large (220-
μF or
greater) bulk power-supply decoupling capacitors should be placed near the TPA3120D2 on the PVCCL and
PVCCR terminals.
Grounding—The AVCC (pins 19 and 20) decoupling capacitor and VBYP (pin 7) capacitor should each be
grounded to analog ground (AGND, pins 8 and 9). The PVCCx decoupling capacitors and VCLAMP
capacitors should each be grounded to power ground (PGND, pins 13, 14, 23, and 24). Analog ground and
power ground should be connected at the thermal pad, which should be used as a central ground connection
or star ground for the TPA3120D2.
Output filter—The reconstruction filter (L1, L2, C9, and C16) should be placed as close to the output terminals
as possible for the best EMI performance. The capacitors should be grounded to power ground.
Thermal pad—The thermal pad must be soldered to the PCB for proper thermal performance and optimal
reliability. The dimensions of the thermal pad and thermal land are described in the mechanical section at the
back of the data sheet. See TI Technical Briefs SLMA002 and SLOA120 for more information about using the
thermal pad. For recommended PCB footprints, see figures at the end of this data sheet.
For an example layout, see the TPA3120D2 Evaluation Module (TPA3120D2EVM) User Manual, (SLOU189).
Both the EVM user manual and the thermal pad application note are available on the TI Web site at
Copyright 2007, Texas Instruments Incorporated
17
Product Folder Link(s): TPA3120D2
相关PDF资料
PDF描述
TPA3121D2PWPG4 AUDIO AMPLIFIER, PDSO24
TPA3121D2PWPRG4 AUDIO AMPLIFIER, PDSO24
TPA3121D2PWP AUDIO AMPLIFIER, PDSO24
TPA3121D2PWPR AUDIO AMPLIFIER, PDSO24
TPA3122D2N 15 W, 2 CHANNEL, AUDIO AMPLIFIER, PDIP20
相关代理商/技术参数
参数描述
TPA3121D2 制造商:TI 制造商全称:Texas Instruments 功能描述:15-W STEREO CLASS-D AUDIO POWER AMPLIFIER
TPA3121D2_1 制造商:TI 制造商全称:Texas Instruments 功能描述:15-W STEREO CLASS-D AUDIO POWER AMPLIFIER
TPA3121D2EVM 功能描述:音频 IC 开发工具 TPA3121D2EVM Eval Mod RoHS:否 制造商:Texas Instruments 产品:Evaluation Kits 类型:Audio Amplifiers 工具用于评估:TAS5614L 工作电源电压:12 V to 38 V
TPA3121D2PWP 功能描述:音频放大器 15W Stereo Class-D Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
TPA3121D2PWPG4 功能描述:音频放大器 15W Stereo Class-D Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel