参数资料
型号: TPA3130D2DAP
厂商: Texas Instruments
文件页数: 18/35页
文件大小: 0K
描述: IC AMP AUD PWR 15W STER 32HTSSOP
标准包装: 46
系列: SpeakerGuard™
类型: D 类
输出类型: 2 通道(立体声)
在某负载时最大输出功率 x 通道数量: 15W x 2 @ 8 欧姆
电源电压: 4.5 V ~ 26 V
特点: 差分输入,静音,短路和热保护,关机
安装类型: 表面贴装
供应商设备封装: 32-HTSSOP
封装/外壳: 32-TSSOP(0.240",6.10mm 宽)裸露焊盘
包装: 管件
其它名称: 296-30432-5
MACHINE THESE
3 EDGES AFTER
ANODIZATION
0.00
–0.60
+.000
–.024
SINK HEIGHT
25.00
.984
1.00
[.118]
3.00
[.118]
0
[.000]
10.00
[.394]
19.50
[.768]
30.50
[1.201]
40.00
[1.575]
50.00±0.38
[1.969±.015]
SINK LENGTH
3.00
[.118]
6.35
[.250]
13.90±0.38
[.547±.015]
BASE WIDTH
6.95
[.274]
5.00
[.197]
40.00
[1.575]
2X 4-40
6.5
x
SLOS708C – APRIL 2012 – REVISED NOVEMBER 2013
Output filter — The ferrite EMI filter (see Figure 34) should be placed as close to the output terminals as
possible for the best EMI performance. The LC filter should be placed close to the outputs. The capacitors
used in both the ferrite and LC filters should be grounded.
For an example layout, see the TPA3116D2 Evaluation Module (TPA3116D2EVM) User Manual. Both the EVM
user manual and the thermal pad application report are available on the TI Web site at http://www.ti.com.
HEAT SINK USED ON THE EVM
The heat sink (part number ATS-TI 10 OP-521-C1-R1) used on the EVM is an 14x25x50 mm extruded aluminum
heat sink with three fins (see drawing below). For additional information on the heat sink, go to www.qats.com.
Figure 35. EVM Heatsink
This size heat sink has shown to be sufficient for continuous output power. The crest factor of music and having
airflow will lower the requirement for the heat sink size and smaller types can be used.
Copyright 2012–2013, Texas Instruments Incorporated
25
Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2
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