参数资料
型号: TPA6030A4PWPG4
厂商: TEXAS INSTRUMENTS INC
元件分类: 音频控制
英文描述: 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO28
封装: GREEN, PLASTIC, TSSOP-28
文件页数: 18/32页
文件大小: 698K
代理商: TPA6030A4PWPG4
TPA6030A4
SLOS395B DECEMBER 2002 REVISED JANUARY 2005
www.ti.com
25
Figure 28
0
20
60
0.25 0.5
1
1.5
2
2.5
3
60
80
100
3.5
4
4.5
5
40
25
40
20
Maximum
A
m
bi
en
tT
emperature
MAXIMUM AMBIENT TEMPERATURE
vs
OUTPUT POWER (PER CHANNEL)
T A
PO Output Power (Per Channel) W
C°
Max
RL = 8 ,
Derating Factor 61 mW/°C
RL = 16 ,
Derating Factor 35.8 mW/°C
RL = 8 ,
Derating Factor 35.8 mW/°C
TA = 25°C
VCC = 12 V
Stereo Operation
Bridge Tied (BTL)
Figure 29
20
0
20
40
60
80
100
0.25
1
2
3
4
5
25
Maximum
A
m
bi
en
tT
emperature
MAXIMUM AMBIENT TEMPERATURE
vs
OUTPUT POWER (PER CHANNEL)
T A
PO Output Power (Per Channel) W
C°
Max
0.5
1.5
2.5
3.5
4.5
VCC = 15 V,
RL = 16 ,
Stereo Operation
Bridge Tied (BTL)
TA = 25°C
Derating Factor 48 mW/°C
Derating Factor 35.8 mW/°C
Figure 30
0
20
40
60
80
100
120
140
160
0.25
0.5
1
1.5
2
2.5
3
3.5
RL = 32
RL = 4
RL = 16
RL = 8
VCC = 12 V,
Derating Factor = 35.8 mW/°C
Stereo Operation
Single Ended (SE)
MAXIMUM AMBIENT TEMPERATURE
vs
OUTPUT POWER (PER CHANNEL)
PO Output Power (Per Channel) W
Maximum
A
m
bi
en
tT
emperature
T A
C°
Max
Figure 31
20
0
20
40
60
80
100
120
140
0.25 0.5
1
1.5
2
2.5
RL = 4
TA = 25°C
VCC = 15 V,
Derating Factor = 35.8 mW/°C
Stereo Operation
Single Ended (SE)
MAXIMUM AMBIENT TEMPERATURE
vs
OUTPUT POWER (PER CHANNEL)
PO Output Power (Per Channel) W
3
3.5
4
4.5
5
RL = 32
Maximum
A
m
bi
en
tT
emperature
T A
C°
Max
RL = 8
RL = 16
The derating factor is crucial for proper thermal performance. The higher the derating factor, the more power can be
dissipated from the device. Board layout affects the derating factor, and should be optimized to achieve the best thermal
performance. Using boards with large copper planes that are uncut by signal or power paths help tremendously. Using
heavier copper, 2 oz. as opposed to 1 oz., is also beneficial. Placing the device close to a fan is another way to enhance
thermal performance. Most importantly, the PowerPAD must be properly soldered down. Refer to the PowerPAD Thermally
Enhanced Package application note (SLMA002).
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