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参数资料
| 型号： | TPL9202PWPG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 电源管理 |
| 英文描述： | 8-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO20 |
| 封装： | GREEN, PLASTIC, HTSSOP-20 |
| 文件页数： | 3/18页 |
| 文件大小： | 432K |
| 代理商： | TPL9202PWPG4 |
www.ti.com
PCB Layout
Application Using a Multilayer PCB
PackageThermalPad
SolderPad(LandPattern)
ThermalVias
PackageOutline
PowerPad
PackageSolderPad
(BottomTrace)
ThermalVia
ComponentTraces
ThermalIsolation
PowerPlaneOnly
1.5748mm
0.0 0.071-mmBoardBase
–
andBottomPad
0.5246 0.5606-mm
–
PowerPlane
(1-ozCu)
1.0142 1.0502-mm
–
GroundPlane
(1-ozCu)
1.5038 1.5748-mm
–
ComponentTrace
(2-ozCu)
2Plane
4Plane
Application Using a Single-Layer PCB
8-CHANNEL RELAY DRIVER
WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008
To maximize the efficiency of this package for application on a single layer or multilayer PCB, certain guidelines
must be followed when laying out this part on the PCB.
The following information is to be used as a guideline only.
For further information, see the PowerPAD concept implementation document.
In a multilayer board application, the thermal vias are the primary method of heat transfer from the package
thermal pad to the internal ground plane (see Figure 4 and Figure 5).
The efficiency of this method depends on several factors: die area, number of thermal vias, thickness of copper,
etc. (see the PowerPAD Thermally Enhanced Package Technical Brief, literature number SLMA002).
Figure 4. Package and PCB Land Configuration for a Multilayer PCB
Figure 5. Multilayer Board (Side View)
In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by a low
thermal-impedance attachment method (solder paste or thermal conductive epoxy). With either method, it is
advisable to use as many copper traces as possible to dissipate the heat.
Copyright 2006–2008, Texas Instruments Incorporated
11
Product Folder Link(s): TPL9202
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TPL9202PWPR | 功能描述:外围驱动器与原件 - PCI 8-Ch Relay Dr with Integrated 5V LDO RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
| TPL9202PWPRG4 | 功能描述:外围驱动器与原件 - PCI 8Ch Relay Drvr RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
| TPL-BA | 功能描述:保险丝 TELPOWER FUSE RoHS:否 制造商:Littelfuse 产品:Surface Mount Fuses 电流额定值:0.5 A 电压额定值:600 V 保险丝类型:Fast Acting 保险丝大小/组:Nano 尺寸:12.1 mm L x 4.5 mm W 安装风格: 端接类型:SMD/SMT 系列:485 |
| TPL-BASI1 | 制造商:Cooper Bussmann 功能描述:TELPOWER FUSE KIT - Bulk |
| TPL-BB | 功能描述:保险丝 TELPOWER FUSE RoHS:否 制造商:Littelfuse 产品:Surface Mount Fuses 电流额定值:0.5 A 电压额定值:600 V 保险丝类型:Fast Acting 保险丝大小/组:Nano 尺寸:12.1 mm L x 4.5 mm W 安装风格: 端接类型:SMD/SMT 系列:485 |
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