1
FEATURES
APPLICATIONS
DESCRIPTION
Laser Marking View
Bump View
B
2
1
A
B
1
2
A
www.ti.com................................................................................................................................................................................................... SLVS921 – MARCH 2009
ULTRA-SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH
Personal Digital Assistants (PDAs)
Low Input Voltage: 1.0 V to 3.6 V
Cellular Phones
Ultra-Low ON-State Resistance
GPS Devices
–
rON = 90 m at VIN = 3.6 V
MP3 Players
–
rON = 100 m at VIN = 2.5 V
Digital Cameras
–
rON = 114 m at VIN = 1.8 V
Peripheral Ports
–
rON = 172 m at VIN = 1.2 V
Portable Instrumentation
500-mA Maximum Continuous Switch Current
RF Modules
Ultra Low Quiescent Current: 82 nA at 1.8 V
Ultra Low Shutdown Current: 44 nA at 1.8 V
Low Control Input Thresholds Enable Use of
TPS22906 is an ultra-small, low ON-state resistance
1.2-V/1.8-V/2.5-V/3.3-V Logic
(rON) load switch with controlled turn on. The device
contains a P-channel MOSFET that operates over an
Controlled Slew Rate to Avoid Inrush Current:
input voltage range of 1.0 V to 3.6 V. The switch is
220
s t
r
controlled by an on/off input (ON), which is capable of
ESD Performance Tested Per JESD 22
interfacing directly with low-voltage control signals. A
–
2000-V Human-Body Model
120-
on-chip load resistor is added for output quick
(A114-B, Class II)
discharge when the switch is turned off.
–
1000-V Charged-Device Model (C101)
TPS22906 is available in a space-saving 4-terminal
Four-Terminal Wafer-Chip-Scale Package
WCSP with 0.5-mm pitch (YZV). The device is
(WCSP)
characterized
for
operation
over
the
free-air
temperature range of –40°C to 85°C.
–
0.9 mm × 0.9 mm,
0.5-mm Pitch, 0.5-mm Height
YZV PACKAGE
TERMINAL ASSIGNMENTS
B
ON
GND
A
VIN
VOUT
2
1
QUICK
rON at 1.8 V
SLEW RATE
MAX OUTPUT
DEVICE
OUTPUT
ENABLE
(TYP)
(TYP at 1.8 V)
CURRENT
DISCHARGE(1)
TPS22906
114 m
220
s
Yes
500 mA
Active high
(1)
This feature discharges the output of the switch to ground through a 120-
resistor, preventing the
output from floating.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
WCSP – YZV (0.5-mm pitch)
Tape and reel
TPS22906YZVR
_ _ _ 5D_(3)
(1)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
(3)
The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.