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参数资料
| 型号： | TPS22922YZPR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 电源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, BGA6 |
| 封装： | GREEN, DSBGA-6 |
| 文件页数： | 14/28页 |
| 文件大小： | 1015K |
| 代理商： | TPS22922YZPR |
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APPLICATION INFORMATION
ON/OFF Control
Input Capacitor
Output Capacitor
Board Layout
www.ti.com........................................................................................................................................ SLVS749A – NOVEMBER 2008 – REVISED DECEMBER 2008
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state so long
as there is no fault. ON is active HI and has a low threshold making it capable of interfacing with low voltage
signals. The ON pin is compatible with standard GPIO logic threshold. It can be used with any microcontroller
with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIOs.
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor must be placed between VIN and GND . A 1-F ceramic
capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop during higher current application. When switching a heavy load, it is recommended to have an
input capacitor about 10 or more times higher than the output capacitor in order to avoid any supply drop.
Due to the integral body diode in the PMOS switch, a CIN greater than CL is highly recommended. A CL greater
than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow
through the body diode from VOUT to VIN.
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND will help minimize the parasitic
electrical effects along with minimizing the case to ambient thermal impedance.
Copyright 2008, Texas Instruments Incorporated
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