参数资料
型号: TPS22924CYZPR
厂商: Texas Instruments
文件页数: 2/20页
文件大小: 0K
描述: IC LOAD SWITCH LIN V ULOW 6DSBGA
标准包装: 1
类型: 通用
输出数: 1
Rds(开): 19.7 毫欧
内部开关:
电流限制: 2A
输入电压: 0.75 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-XFBGA,DSBGA
供应商设备封装: 6-DSBGA
包装: 标准包装
产品目录页面: 1044 (CN2011-ZH PDF)
其它名称: 296-25510-6
SLVSA52C – NOVEMBER 2009 – REVISED JUNE 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
T A
PACKAGE (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING (3)
–40°C to 85°C
–40°C to 85°C
DSBGA – YZP (0.5-mm pitch)
DSBGA – YZP (0.5-mm pitch)
Reel
Reel
TPS22924CYZPR (without back
side coating)
TPS22924CYZPRB (with back
side coating)
_ _ _ 5L _
_ _ _ 5L _
(1)
(2)
(3)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ? = Pb-free).
YZP PACKAGE
C
B
A
2 1
Laser Marking View
C
B
A
1 2
Bump View
TERMINALS ASSIGNMENTS (YZP PACKAGE)
C
B
A
GND
VOUT
VOUT
1
TERMINAL FUNCTIONS
ON
VIN
VIN
2
NO.
C1
C2
A1, B1
A2, B2
NAME
GND
ON
VOUT
VIN
DESCRIPTION
Ground
Switch control input, active high. Do not leave floating
Switch output
Switch input, bypass this input with a ceramic capacitor to ground
2
Product Folder Links: TPS22924C
Copyright ? 2009–2013, Texas Instruments Incorporated
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