参数资料
型号: TPS2420RSAR
厂商: TEXAS INSTRUMENTS INC
元件分类: 电源管理
英文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, PQCC16
封装: 4 X 4 MM, PLASTIC, QFN-16
文件页数: 9/29页
文件大小: 1368K
代理商: TPS2420RSAR
3
6
FAULT
CT
3
T
10
C
20
10
0.514
10
38.9
10
-
=
=
(
)
(
)
(
)
(
)
( )
AD _ IN max
IMON
LOAD max
63,000 V
63,000 2.5
R
63 k
I
2.5
=
W
(
) (
)
( )
IMON
LOAD
IMON
63,000 V
63,000 1.8
I
1.81 A
R
62,500
=
www.ti.com
SLUS903C – JANUARY 2009 – REVISED AUGUST 2010
Because IFAULT satisfies the spin up current, the timer can be set for the additional loading of charging the
capacitor. Estimate approximately 20 ms. Use either Equation 12 or Table 2 to estimate the capacitance.
(12)
For a scaled analog readback of the current from VIN, set the IMON resistor. In Equation 13 , the VAD_INMAX is the
desired full scale A/D converter voltage. The largest value of VAD_INMAX 2.5 V. ILOADMAX is the full scale current,
2.5 A.
(13)
The read-back voltage at the IMON pin, VIMON, indicates the instantaneous current output. Using equation
Equation 14 again, determine the current output for example, a 1.8-V VIMON. Substitute VIMON for VAD_INMAX and
ILOAD for ILOADMAX and solve for ILOAD, (Equation 14).
(14)
Layout
Support Components
Locate all TPS2420 support components, RSET, CT, etc. or any input or output voltage clamps, close to their
connection pin. Connect the other end of the component to the inner layer GND without trace length.
PowerPad
When properly mounted the PowerPad package provides significantly greater cooling ability than an ordinary
package. To operate at rated power the Power Pad must be soldered directly to the PC board GND plane
directly under the device. The PowerPad is at GND potential and can be connected using multiple vias to inner
layer GND. Other planes, such as the bottom side of the circuit board can be used to increase heat sinking in
higher current applications.
Refer to Technical Briefs: PowerPAD Thermally Enhanced Package (TI Literature Number SLMA002) and
PowerPAD Made Easy (TI Literature Number SLMA004) for more information on using this PowerPadTM
package.These documents are available at www.ti.com (Search by Keyword).
Copyright 2009–2010, Texas Instruments Incorporated
17
Product Folder Link(s): TPS2420
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