参数资料
型号: TPS40021PWPG4
厂商: TEXAS INSTRUMENTS INC
元件分类: 稳压器
英文描述: 0.01 A SWITCHING CONTROLLER, 1100 kHz SWITCHING FREQ-MAX, PDSO16
封装: GREEN, PLASTIC, HTSSOP-16
文件页数: 9/36页
文件大小: 724K
代理商: TPS40021PWPG4
TPS40020
TPS40021
SLUS535D MARCH 2003 REVISED JULY 2007
www.ti.com
17
APPLICATION INFORMATION
Manufacturer’s instructions should be followed for proper layout of the external MOSFETs. Thermal
impedances given in the manufacturer’s datasheets are for a given mounting technique with a specified surface
area under the drain of the MOSFET. PowerPad package information can be found in the APPLICATION
INFORMATION section of this datasheet.
Refer to TPS40021 EVM001 High Efficiency Synchronous Buck Converter with PWM Controller Evaluation
Module (HPA009) User’s Guide, (Literature No. sluu144A) for a typical board layout.
The PowerPAD package provides low thermal impedance for heat removal from the device. The PowerPAD
derives its name and low thermal impedance from the large bonding pad on the bottom of the device. The circuit
board must have an area of solder-tinned-copper underneath the package. The dimensions of this area
depends on the size of the PowerPAD package. For a 16-pin TSSOP (PWP) package the area is
5 mm x 3.4 mm [3].
Thermal vias connect this area to internal or external copper planes and should have a drill diameter sufficiently
small so that the via hole is effectively plugged when the barrel of the via is plated with copper. This plug is
needed to prevent wicking the solder away from the interface between the package body and the solder-tinned
area under the device during solder reflow. Drill diameters of 0.33 mm (13 mils) works well when 1-oz copper
is plated at the surface of the board while simultaneously plating the barrel of the via. If the thermal vias are
not plugged when the copper plating is performed, then a solder mask material should be used to cap the vias
with a diameter equal to the via diameter of 0.1 mm minimum. This capping prevents the solder from being
wicked through the thermal vias and potentially creating a solder void under the package. Refer to PowerPAD
Thermally Enhanced Package[3] for more information on the PowerPAD package.
相关PDF资料
PDF描述
TC1303B-1A1EUNTR 0.5 A SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PDSO10
TC1303B-1G2EMF 0.5 A SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PDSO10
TC1303B-1L1EUNTR 0.5 A SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PDSO10
TC1303B-1L3EUNTR 0.5 A SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PDSO10
TC1303B-1M0EUNTR 0.5 A SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PDSO10
相关代理商/技术参数
参数描述
TPS40021PWPR 功能描述:DC/DC 开关控制器 Low Input Sync Buck Cntrlr source/sink RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK
TPS40021PWPRG4 功能描述:DC/DC 开关控制器 Low Input Sync Buck Cntrlr source/sink RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK
TPS40022PWP 制造商:Texas Instruments 功能描述:
TPS40040 制造商:TI 制造商全称:Texas Instruments 功能描述:LOW PIN COUNT, LOW VIN (2.5 V TO 5.5 V) SYNCHRONOUS BUCK DC-TO-DC CONTROLLER WITH ENABLE
TPS40040DRBR 功能描述:DC/DC 开关控制器 Lo Vin Synch Buck DC/DC Cntrlr RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK