参数资料
型号: TPS40070PWPRG4
厂商: TEXAS INSTRUMENTS INC
元件分类: 稳压器
英文描述: 2 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO16
封装: GREEN, PLASTIC, HTSSOP-16
文件页数: 9/28页
文件大小: 655K
代理商: TPS40070PWPRG4
P
T +
2
P
D
V
DR
) IQ
V
IN
(Watts)
(16)
P
T + 2
Qg
f
SW ) IQ
V
IN
(Watts)
(17)
qJA + 36.51OC W
(18)
P
T +
T
J * TA
qJA
(Watts)
(19)
f
SW +
T
J*TA
qJA VDD
* IQ
2
Qg
(Hz)
(20)
BOOST DIODE
LOW VOLTAGE OPERATION
GROUNDING AND BOARD LAYOUT
www.ti.com .................................................................................................................................................. SLUS582J – DECEMBER 2003 – REVISED APRIL 2009
And the total power dissipation in the TPS4007x, assuming the same MOSFET is selected for both the high-side
and synchronous rectifier is described in Equation 16.
or
where:
I
Q is the quiescent operating current (neglecting drivers)
The maximum power capability of the TPS4007x PowerPAD package is dependent on the layout as well as air
flow. The thermal impedance from junction to air assuming 2-oz. copper trace and thermal pad with solder and
no air flow is see teh application report titledPowerPAD Thermally Enhanced Package (SLMA002) for detailed
information on PowerPAD package mounting and usage.
The maximum allowable package power dissipation is related to ambient temperature by Equation 19.
Substituting Equation 19 into Equation 18 and solving for fSW yields the maximum operating frequency for the
TPS4007x. The result is described in Equation 20.
The TPS4007x series has internal diodes to charge the boost capacitor connected from SW to BOOST. The drop
across this diode is rather large at 1.4-V nominal at room temperature. If this drop is too large for a particular
application, an external diode may be connected from DBP (anode) to BOOST (cathode). This provides
significantly improved gate drive for the high side FET, especially at lower input voltages.
If the programmable UVLO is set to less than 6.5 V nominal, connect a 330-k
resistor across the soft-start
capacitor. This eliminates a race condition inside the device that can lead to an output voltage overshoot on
power down of the part. If operation is expected below -10°C ambient temperature and at less than 5-V input, it
is recommended that a diode be connected from LVBP to DBP. (See Figure 16).
The TPS4007x provides separate signal ground (SGND) and power ground (PGND) pins. Care should be given
to proper separation of the circuit grounds. Each ground should consist of a plane to minimize its impedance if
possible. The high power noisy circuits such as the output, synchronous rectifier, MOSFET driver decoupling
capacitor (DBP), and the input capacitor should be connected to PGND plane.
Sensitive nodes such as the FB resistor divider and RT should be connected to the SGND plane. The SGND
plane should only make a single point connection to the PGND plane. It is suggested that the SGND pin be tied
to the copper area for the PowerPAD underneath the chip. Tie the PGND to the PowerPAD copper area as well
and make the connection to the power circuit ground from the PGND pin. Reference the output voltage divider to
the SGND pin.
Copyright 2003–2009, Texas Instruments Incorporated
17
Product Folder Link(s): TPS40070 TPS40071
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TPS40071PWPR 2 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO16
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