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| 型号： | TPS51727RHATG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 稳压器 |
| 英文描述： | DUAL SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PQCC40 |
| 封装： | 6 X 6 MM, GREEN, PLASTIC, QFN-40 |
| 文件页数： | 29/42页 |
| 文件大小： | 0K |
| 代理商： | TPS51727RHATG4 |
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Power Chain Symmetry
Place Analog Components as Close to the Device as Possible
Grounding Recommendations
Decoupling Recommendations
Conductor Widths
www.ti.com ..................................................................................................................................................... SLUS806B – APRIL 2008 – REVISED JANUARY 2009
The TPS51727 does not require special care in the layout of the power chain components, because independent
isolated current feedback is provided. Make every effort to lay out the phases in a symmetrical manner. The
current feedback from each phase must be free of noise and have the same effective current sense resistance.
Place components close to the device in the following order.
1. CS pin noise filtering components
2. DROOP pin compensation component
3. Decoupling capacitor
4. ISLEW resistor (RSLEW)
The TPS51727 has separate analog and power grounds, and a thermal pad. The normal procedure for
connecting these is:
1. Connect the thermal pad to PGND.
2. Tie the thermal pad to the system ground plane with at least 4 small vias or one large via.
3. GND can be connected to any quiet space. A quiet space is defined as a spot where no power supply
switching currents are likely to flow. This applies to all switching converters on the same board. Use a single
point connection to the point, and pour a GND island around the analog components.
4. Make sure the bottom MOSFET source connection and the decoupling capacitors have plenty of vias.
Decouple V5 to PGND with at least a 2.2-F ceramic capacitor. This fits best on the opposite side of the
device.
Use double vias to connect to the device.
Decouple V5FILT with 1-F to AGND with leads as short as possible.
Decouple VREF to AGND with 0.22-F, with short leads as short as possible.
Maximize the widths of power, ground and drive signal connections.
For conductors in the power path, be sure there is adequate trace width for the amount of current flowing
through the traces.
Make sure there are sufficient vias for connections between layers.
Use a minimum of 1 via per ampere of current
Copyright 2008–2009, Texas Instruments Incorporated
35
Product Folder Link(s): TPS51727
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