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参数资料
| 型号： | TPS54429PWP |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 稳压器 |
| 英文描述： | 0.01 A SWITCHING REGULATOR, 700 kHz SWITCHING FREQ-MAX, PDSO14 |
| 封装： | GREEN, PLASTIC, HTSSOP-14 |
| 文件页数： | 7/22页 |
| 文件大小： | 651K |
| 代理商： | TPS54429PWP |
VOUT
VFB
VREG5
SS
GND
PG
EN
VIN2
VIN1
VBST
SW2
SW1
PGND1
PGND2
EXPOSED
POWERPAD
AREA
BOOST
CAPACITOR
VOUT
VIA toGroundPlane
OUTPUT
INDUCTOR
OUTPUT
FILTER
CAPACITOR
SLOW
START
CAP
ANALOG
GROUND
TRACE
VIN
INPUT
BYPASS
CAPACITOR
VIN
FEEDBACK
RESISTORS
EtchonBottomLayer
orUnderComponent
ToEnable
Control
POWERGROUND
BIAS
CAP
Additional
Thermal
Vias
Additional
Thermal
Vias
Connectionto
POWERGROUND
oninternalor
bottomlayer
VINOVER
CURRENT
STABILITY
CAPACITOR
SLVSAS1
– FEBRUARY 2011
LAYOUT CONSIDERATIONS
1. Keep the input switching current loop as small as possible.
2. Keep the SW node as physically small and short as possible to minimize parasitic capacitance and
inductance and to minimize radiated emissions. Kelvin connections should be brought from the output to the
feedback pin of the device.
3. Keep analog and non-switching components away from switching components.
4. Make a single point connection from the signal ground to power ground.
5. Do not allow switching current to flow under the device.
6. Keep the pattern lines for VIN and PGND broad.
7. Exposed pad of device must be connected to PGND with solder.
8. VREG5 capacitor should be placed near the device, and connected PGND.
9. Output capacitor should be connected to a broad pattern of the PGND.
10. Voltage feedback loop should be as short as possible, and preferably with ground shield.
11. Lower resistor of the voltage divider which is connected to the VFB pin should be tied to SGND.
12. Providing sufficient via is preferable for VIN, SW and PGND connection.
13. PCB pattern for VIN, SW, and PGND should be as broad as possible.
14. VIN Capacitor should be placed as near as possible to the device.
Figure 15. PCB Layout
2011, Texas Instruments Incorporated
15
Product Folder Link(s) :TPS54429
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