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参数资料
| 型号： | TPS61032RSARG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 稳压器 |
| 英文描述： | 4.5 A BATTERY CHARGE CONTROLLER, 700 kHz SWITCHING FREQ-MAX, PQCC16 |
| 封装： | 4 X 4 MM, GREEN, PLASTIC, QFN-16 |
| 文件页数： | 9/28页 |
| 文件大小： | 877K |
| 代理商： | TPS61032RSARG4 |
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SW
C1
10
F
L1
6.8
H
R1
R2
VBAT
VOUT
R6
C2
2.2
F
C3
220
F
LBO
PGND
LBI
SYNC
EN
GND
TPS61032
List of Components:
U1 = TPS6103xPWP
L1 = Sumida CDRH124–6R8
C1, C2, C5, C6 = X7R,X5R Ceramic
C3 = Low ESR Tantalum
DS1 = BAT54S
LBO
C5
0.1
F
DS1
C6
1
F
VCC2 –5 V
Unregulated
Auxiliary Output
Battery
Input
FB
VCC1 5 V
Boost Main Output
THERMAL INFORMATION
P
D(MAX)
+
T
J(MAX)
* T
A
R
q
JA
+ 125°C * 85°C
36.5
°C W
+ 1096 mW
TPS61030
TPS61031, TPS61032
SLUS534D – SEPTEMBER 2002 – REVISED APRIL 2004
Layout Considerations (continued)
Figure 21. Power Supply Solution With Auxiliary Negative Output Voltage
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum junction temperature (TJ) of the TPS6103x devices is 125°C. The thermal resistance of the 16-pin
TSSOP PowerPAD package (PWP) is RΘJA = 36.5 °C/W (QFN package, RSA, 38.1 °C/W), if the PowerPAD is
soldered. Specified regulator operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the
maximum power dissipation for the PWP package is about 1096 mW, for the RSA package it is about 1050 mW.
More power can be dissipated if the maximum ambient temperature of the application is lower.
17
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