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参数资料
| 型号： | TPS61200DRCRG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 稳压器 |
| 英文描述： | 1.5 A BATTERY CHARGE CONTROLLER, 1650 kHz SWITCHING FREQ-MAX, PDSO10 |
| 封装： | 3 X 3 MM, GREEN, PLASTIC, SON-10 |
| 文件页数： | 9/28页 |
| 文件大小： | 1012K |
| 代理商： | TPS61200DRCRG4 |
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Capacitor at VAUX
Layout Considerations
THERMAL INFORMATION
P
D(MAX)
+
T
J(MAX)
* T
A
R
q
JA
+ 125°C * 85°C
48.7
°C W
+ 820 mW
(6)
SLVS577B – MARCH 2007 – REVISED FEBRUARY 2008
Between the VAUX pin and GND a capacitor must be connected. This capacitor is used to maintain and filter the
control supply voltage. It is charged during startup and before the main output VOUT is turned on. To ensure
stable operation, using at least 0.1
F is recommended. At output voltages below 2.5 V, the capacitance should
be in the range of 1
F. Since this capacitor is also used as a snubber capacitor for the main switch, using a
ceramic capacitor with low ESR is important.
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, it is recommended to use short traces as well, separated from the power ground traces. This
avoids ground shift problems, which can occur due to superimposition of power ground current and control
ground current.
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6120x devices is 125°C. The thermal
resistance of the 10-pin QFN 3
× 3 package (DRC) is RθJA = 48.7 °C/W, if the PowerPAD is soldered. Specified
regulator operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power
dissipation is about 820 mW. More power can be dissipated if the maximum ambient temperature of the
application is lower.
Copyright 2007–2008, Texas Instruments Incorporated
17
Product Folder Link(s): TPS61200 TPS61201 TPS61202
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| TPS61200DRCT | 功能描述:直流/直流开关调节器 0.3V In Vltg Boost RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| TPS61200DRCT | 制造商:Texas Instruments 功能描述:DC/DC Charge Pump Converter (DC-DC) IC 制造商:Texas Instruments 功能描述:IC, SYNC BOOST CONVERTER, SON-10 |
| TPS61200DRCTG4 | 功能描述:直流/直流开关调节器 0.3V Input Vltg Boost Converter RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| TPS61200EVM-179 | 功能描述:电源管理IC开发工具 TPS61200EVM-179 Evaluation Module RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| TPS61201 | 制造商:TI 制造商全称:Texas Instruments 功能描述:LOW INPUT VOLTAGE SYNCHRONOUS BOOST CONVERTER WITH 1.3-A SWITCHES |
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