LAYOUT CONSIDERATIONS
Minimizethearea
ofSWtrace
SW
AGND
EN
T
h
e
rm
a
l
P
a
d
SW
VIN
SS
DMIC
PGND
COMP
OVP
FREQ
FB
PGND
OUTPUT
CAPACITOR
PGND
VOUT
SCHOTTKEY
Placeenough
VIAsaround
thermalpadto
enhancethermal
performance
COMPENSATION
FEEDBACK
SW
AGND
INDUCTOR
VIN
INPUT
CAPACITOR
LEDString
THERMAL CONSIDERATIONS
A
D(max)
θJA
125 C
T
P
=
R
°
-
(8)
SLVS893 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com
As for all switching power supplies, especially those running at high switching frequency and high currents,
layout is an important design step. If layout is not carefully done, the regulator could suffer from instability as well
as noise problems. To maximize efficiency, switch rise and fall times are very fast. To prevent radiation of high
frequency noise (eg. EMI), proper layout of the high frequency switching path is essential. Minimize the length
and area of all traces connected to the SW pin and always use a ground plane under the switching regulator to
minimize interplane coupling. The high current path including the switch, Schottky diode, and output capacitor,
contains nanosecond rise and fall times and should be kept as short as possible. The input capacitor needs not
only to be close to the VIN pin, but also to the GND pin in order to reduce the Iinput supply ripple.
As mentioned before, the maximum IC junction temperature should be restricted to 125°C under normal
operating conditions. This restriction limits the power dissipation of the TPS61500. Calculate the maximum
allowable dissipation, PD(max), and keep the actual dissipation less than or equal to PD(max). The
maximum-power-dissipation limit is determined using the following equation:
where, TA is the maximum ambient temperature for the application. RθJA is the thermal resistance
junction-to-ambient given in Power Dissipation Table.
The TPS61500 comes in a thermally enhanced TSSOP package. This package includes a thermal pad that
improves the thermal capabilities of the package. The RθJA of the TSSOP package greatly depends on the PCB
layout.
14
Copyright 2008, Texas Instruments Incorporated