参数资料
型号: TPS62321YZDT
厂商: TEXAS INSTRUMENTS INC
元件分类: 稳压器
英文描述: 0.89 A SWITCHING REGULATOR, 3350 kHz SWITCHING FREQ-MAX, BGA8
封装: GREEN, DSBGA-8
文件页数: 15/37页
文件大小: 1401K
代理商: TPS62321YZDT
www.ti.com
THERMAL INFORMATION
P
D(MAX)
+
T
J(MAX)
* T
A
R
q
JA
+ 125°C * 85°C
250
°C W
+ 160 mW
(6)
CHIP SCALE PACKAGE DIMENSIONS
SLVS528E – JULY 2004 – REVISED NOVEMBER 2007
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the
power-dissipation limits of a given component
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6230x, TPS6231x, and TPS6232x devices is
125
°C. The thermal resistance of the 8-pin CSP package (YZD, YZ and YED) is RθJA = 250°C/W. Specified
regulator operation is specified to a maximum ambient temperature TA of 85°C. Therefore, the maximum power
dissipation is about 160 mW. More power can be dissipated if the maximum ambient temperature of the
application is lower, or if the PowerPAD package (DRC) is used.
The TPS6230x, TPS6231x, and TPS6232x are also available in an 8-bump chip scale package (YZD, YZ
NanoFree and YED, NanoStar). The package dimensions are given as:
D = 1.970 ±0.05 mm
E = 0.970 ±0.05 mm
22
Copyright 2004–2007, Texas Instruments Incorporated
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