参数资料
| 型号： | TPS73601MDCQREP |
| 厂商： | Texas Instruments |
| 文件页数： | 14/27页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .4A SOT223-6 |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 1.2 V ~ 5.5 V |
| 输入电压： | 1.7 V ~ 5.5 V |
| 电压 - 压降（标准）： | 0.075V @ 400mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 400mA（最小值） |
| 电流 - 限制（最小）： | 400mA |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-223-6 |
| 供应商设备封装： | SOT-223-6 |
| 包装： | 标准包装 |
| 产品目录页面： | 1065 (CN2011-ZH PDF) |
| 其它名称： | 296-23483-6 |
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TPS73601-EP, TPS73615-EP, TPS73618-EP
TPS73625-EP, TPS73630-EP, TPS73632-EP, TPS73633-EP
SGLS326C – APRIL 2006 – REVISED FEBRUARY 2009 .................................................................................................................................................. www.ti.com
Reverse Current
35°C
above
the
maximum
expected
ambient
The NMOS pass element of the TPS736xx provides
inherent protection against current flow from the
output of the regulator to the input when the gate of
the pass device is pulled low. To ensure that all
charge is removed from the gate of the pass element,
EN must be driven low before the input voltage is
removed. If this is not done, the pass element may be
left on due to stored charge on the gate.
After EN is driven low, no bias voltage is needed on
any pin for reverse current blocking. Note that
reverse current is specified as the current flowing out
of the IN pin due to voltage applied on the OUT pin.
condition of the application. This produces a
worst-case junction temperature of 125°C at the
highest expected ambient temperature and
worst-case load.
The internal protection circuitry of the TPS736xx has
been designed to protect against overload conditions.
It was not intended to replace proper heatsinking.
Continuously running the TPS736xx into thermal
shutdown degrades reliability.
Power Dissipation
The ability to remove heat from the die is different for
There is additional current flowing into the OUT pin
each
package
type,
presenting
different
due to the 80-k ? internal resistor divider to ground
(see Figure 2 and Figure 3 ).
For the TPS73601, reverse current may flow when
V FB is more than 1 V above V IN .
Thermal Protection
considerations in the PCB layout. The PCB area
around the device that is free of other components
moves the heat from the device to the ambient air.
Performance data for JEDEC low- and high-K boards
are shown in the Power Dissipation Ratings table.
Using heavier copper increases the effectiveness in
removing heat from the device. The addition of plated
Thermal protection disables the output when the
through-holes
to
heat-dissipating
layers
also
junction temperature rises to approximately 160°C,
allowing the device to cool. When the junction
temperature cools to approximately 140°C, the output
circuitry is again enabled. Depending on power
dissipation, thermal resistance, and ambient
temperature, the thermal protection circuit may cycle
on and off. This limits the dissipation of the regulator,
protecting it from damage due to overheating.
Any tendency to activate the thermal protection circuit
improves the heatsink effectiveness.
Power dissipation depends on input voltage and load
conditions. Power dissipation is equal to the product
of the output current times the voltage drop across
the output pass element (V IN to V OUT ):
P D + (V IN * V OUT ) I OUT (6)
Power dissipation can be minimized by using the
lowest-possible input voltage necessary to ensure the
indicates
excessive
power
dissipation
or
an
required output voltage.
inadequate heatsink. For reliable operation, junction
temperature should be limited to 125°C maximum. To
estimate the margin of safety in a complete design
(including heatsink), increase the ambient
temperature until the thermal protection is triggered;
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
Package Mounting
Solder-pad footprint recommendations for the
TPS736xx are presented in application bulletin Solder
Pad Recommendations for Surface-Mount Devices
(AB-132), available from the TI web site at
14
Copyright ? 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS73601-EP TPS73615-EP TPS73618-EP TPS73625-EP TPS73630-EP TPS73632-EP
相关PDF资料 |
PDF描述 |
|---|---|
| HCC28DREN-S93 | CONN EDGECARD 56POS .100 EYELET |
| HBC28DREN-S93 | CONN EDGECARD 56POS .100 EYELET |
| HCC28DREH-S93 | CONN EDGECARD 56POS .100 EYELET |
| HBC28DREH-S93 | CONN EDGECARD 56POS .100 EYELET |
| AMM10DSEI-S13 | CONN EDGECARD 20POS .156 EXTEND |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TPS73601MDCQREPG4 | 功能描述:低压差稳压器 - LDO EP Cap-Free Nmos 400-Ma LDO Reg RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS73601MDRBREP | 功能描述:低压差稳压器 - LDO EP Cap-Free,Nmos 400Ma LDO Reg RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS73601QDBVRQ1 | 功能描述:低压差稳压器 - LDO AC Single Out LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS736125DRBR | 功能描述:低压差稳压器 - LDO Cap-Free NMOS 400mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS736125DRBRG4 | 功能描述:低压差稳压器 - LDO Cap-Free NMOS 400mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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