参数资料
型号: TPS75301QPWPREP
厂商: Texas Instruments
文件页数: 21/33页
文件大小: 0K
描述: IC REG LDO ADJ 1.5A 20HTSSOP
标准包装: 1
稳压器拓扑结构: 正,可调式
输出电压: 1.5 V ~ 5 V
输入电压: 2.7 V ~ 5 V
电压 - 压降(标准): 0.16V @ 1.5A
稳压器数量: 1
电流 - 输出: 1.5A(最小值)
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 20-TSSOP(0.173",4.40mm 宽)裸露焊盘
供应商设备封装: 20-HTSSOP
包装: 标准包装
其它名称: 296-22505-6
TPS75101 EP, '75115 EP, '75118 EP, '75125 EP, '75133 EP WITH POWER GOOD
TPS75301 EP, TPS75315 EP, TPS75318 EP, TPS75325 EP, TPS75333 EP WITH RESET
FAST TRANSIENT RESPONSE 1.5 A LOW DROPOUT VOLTAGE REGULATORS
SGLS158 ? APRIL 2003
THERMAL INFORMATION
thermally enhanced TSSOP-20 (PWP ? PowerPad ? )
The thermally enhanced PWP package is based on the 20-pin TSSOP, but includes a thermal pad [see
Figure 25(c)] to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO220-type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These
packages, however, suffer from several shortcomings: they do not address the very low profile requirements (< 2
mm) of many of today’s advanced systems, and they do not offer a pin-count high enough to accommodate
increasing integration. On the other hand, traditional low-power surface-mount packages require power-dissipation
derating that severely limits the usable range of many high-performance analog circuits.
The PWP package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PWP package is designed to optimize the heat transfer to the PWB. Because of the very small size and limited
mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is formed using a lead-frame design (patent pending) and
manufacturing technique to provide the user with direct connection to the heat-generating IC. When this pad is
soldered or otherwise coupled to an external heat dissipator, high power dissipation in the ultrathin, fine-pitch,
surface-mount package can be reliably achieved.
DIE
Side View (a)
Thermal
Pad
DIE
End View (b)
Bottom View (c)
Figure 25. Views of Thermally Enhanced PWP Package
Because the conduction path has been enhanced, power-dissipation capability is determined by the thermal
considerations in the PWB design. For example, simply adding a localized copper plane (heat-sink surface), which
is coupled to the thermal pad, enables the PWP package to dissipate 2.5 W in free air (reference
Figure 27(a), 8 cm 2 of copper heat sink and natural convection). Increasing the heat-sink size increases the power
dissipation range for the component. The power dissipation limit can be further improved by adding airflow to a
PWB/IC assembly (see Figures 26 and 27). The line drawn at 0.3 cm 2 in Figures 26 and 27 indicates performance
at the minimum recommended heat-sink size, illustrated in Figure 29.
POST OFFICE BOX 655303
? DALLAS, TEXAS 75265
21
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TPS75301QPWPRG4 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
TPS75301QPWPRQ1 功能描述:低压差稳压器 - LDO Fast-Trans-Resp 1.5A LDO Vltg Reg RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
TPS75315QPWP 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
TPS75315QPWPG4 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
TPS75315QPWPR 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20