参数资料
| 型号： | TPS75325QPWPREP |
| 厂商： | Texas Instruments |
| 文件页数： | 26/33页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.5V 1.5A 20HTSSOP |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.5V |
| 输入电压： | 2.7 V ~ 5 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1.5A（最小值） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽）裸露焊盘 |
| 供应商设备封装： | 20-HTSSOP |
| 包装： | 标准包装 |
| 其它名称： | 296-22508-6 |
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PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
18-Sep-2008
Orderable Device
Status (1)
Package
Package
Pins Package Eco Plan (2)
Lead/Ball Finish
MSL Peak Temp (3)
Type
Drawing
Qty
TPS75125MPWPREP
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
TPS75301QPWPREP
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
TPS75315QPWPREP
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
TPS75318QPWPREP
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
TPS75325QPWPREP
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
TPS75333QPWPREP
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
V62/03636-06XE
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
V62/03636-07XE
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
V62/03636-08XE
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
V62/03636-09XE
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
V62/03636-10XE
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
V62/03636-14XE
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
相关PDF资料 |
PDF描述 |
|---|---|
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| ASC20DRAN | CONN EDGECARD 40POS .100 R/A DIP |
| LT3845EFE#PBF | IC REG CTRLR BUCK PWM CM 16TSSOP |
| RBM10DRSD-S664 | CONN EDGECARD 20POS DIP .156 SLD |
| 1008-022M | INDUCTOR .0022UH UNSHIELDED SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TPS75325QPWPRG4 | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75325QPWPRQ1 | 功能描述:低压差稳压器 - LDO Fast-Transient Response1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75333QPWP | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75333QPWP | 制造商:Texas Instruments 功能描述:V REG +3.3V SMD 75333 TSSOP20 |
| TPS75333QPWPG4 | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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