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| 型号： | TPS82677SIPT |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 稳压器 |
| 英文描述： | 0.6 A SWITCHING REGULATOR, 6000 kHz SWITCHING FREQ-MAX, BGA8 |
| 封装： | 2.30 X 2.90 MM, 1 MM HEIGHT, GREEN, USIP-8 |
| 文件页数： | 13/28页 |
| 文件大小： | 943K |
| 代理商： | TPS82677SIPT |
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Copper Trace Width
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Solder Mask Thickness
M0200-01
SLVSAI0A
– OCTOBER 2010 – REVISED APRIL 2011
LAYOUT CONSIDERATION
In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 43 shows the appropriate diameters for a MicroSiPTM
layout.
Figure 43. Recommended Land Pattern Image and Dimensions
SOLDER PAD
SOLDER MASK (5)
COPPER
STENCIL (6)
COPPER PAD
STENCIL THICKNESS
DEFINITIONS(1)(2)(3)(4)
OPENING
THICKNESS
OPENING
Non-solder-mask
0.30mm
0.360mm
1oz max (0.032mm)
0.34mm diameter
0.1mm thick
defined (NSMD)
(1)
Circuit traces from non-solder-mask defined PWB lands should be 75
μm to 100μm wide in the exposed area inside the solder mask
opening. Wider trace widths reduce device stand off and affect reliability.
(2)
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
(3)
Recommend solder paste is Type 3 or Type 4.
(4)
For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue
performance.
(5)
Solder mask thickness should be less than 20
μm on top of the copper circuit pattern.
(6)
For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste
volume control.
SURFACE MOUNT INFORMATION
The TPS8267x MicroSiP
DC/DC converter uses an open frame construction that is designed for a fully
automated assembly process and that features a large surface area for pick and place operations. See the "Pick
Area" in the package drawings.
Package height and weight have been kept to a minimum thereby to allow the MicroSiP
device to be handled
similarly to a 0805 component.
See JEDEC/IPC standard J-STD-20b for reflow recommendations.
20
Copyright
2010–2011, Texas Instruments Incorporated
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TPS82678 | 制造商:TI 制造商全称:Texas Instruments 功能描述:600-mA, HIGH-EFFICIENCY MicroSiP? STEP-DOWN CONVERTER (PROFILE <1.0mm) |
| TPS82678SIP | 制造商:TI 制造商全称:Texas Instruments 功能描述:600-mA, HIGH-EFFICIENCY MicroSiP? STEP-DOWN CONVERTER (PROFILE <1.0mm) |
| TPS8267XEVM | 制造商:TI 制造商全称:Texas Instruments 功能描述:The TPS82671 and TPS82675 devices are series of high-frequency, synchronous, step-down dc-dc converters optimized for battery-powered portable applications |
| TPS8268090SIPT | 功能描述:Buck Switching Regulator IC Positive Fixed 0.9V 1 Output 1.6A 9-SMD Module 制造商:texas instruments 系列:- 包装:剪切带（CT） 零件状态:有效 功能:降压 输出配置:正 拓扑:降压 输出类型:固定 输出数:1 电压 - 输入（最小值）:2.5V 电压 - 输入（最大值）:5.5V 电压 - 输出（最小值/固定）:0.9V 电压 - 输出（最大值）:- 电流 - 输出:1.6A 频率 - 开关:5.5MHz 同步整流器:是 工作温度:-40°C ~ 85°C（TA） 安装类型:表面贴装 封装/外壳:9-SMD 模块 供应商器件封装:9-USIP 标准包装:1 |
| TPS8268105SIPT | 功能描述:Buck Switching Regulator IC Positive Fixed 1.05V 1 Output 1.6A 9-SMD Module 制造商:texas instruments 系列:- 包装:剪切带（CT） 零件状态:有效 功能:降压 输出配置:正 拓扑:降压 输出类型:固定 输出数:1 电压 - 输入（最小值）:2.5V 电压 - 输入（最大值）:5.5V 电压 - 输出（最小值/固定）:1.05V 电压 - 输出（最大值）:- 电流 - 输出:1.6A 频率 - 开关:5.5MHz 同步整流器:是 工作温度:-40°C ~ 85°C（TA） 安装类型:表面贴装 封装/外壳:9-SMD 模块 供应商器件封装:9-USIP 标准包装:1 |
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