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参数资料
| 型号： | TS2026 |
| 厂商： | Taiwan Semiconductor Co., Ltd. |
| 元件分类： | 基准电压源/电流源 |
| 英文描述： | Dual-Channel Power Distribution Switch |
| 中文描述： | 双通道配电开关 |
| 文件页数： | 5/7页 |
| 文件大小： | 279K |
| 代理商： | TS2026 |
TS2026
5-7
2005/11 rev. A
Function Description
Input and Output
IN is the power supply connection to the logic circuitry and the drain of the output MOSFET. OUT is the source of the
output MOSFET. In a typical circuit, current flows from IN to OUT toward the load. If V
OUT
is greater than V
IN
, current will
flow from OUT to IN, since the switch is bidirectional when enabled. The output MOSFET and driver circuitry are also
designed to allow the MOSFET source to be externally forced to a higher voltage than the drain (V
OUT
> V
IN
) when the
switch is disabled. In this situation, the TS2026 prevents undesirable current flow from OUT to IN.
Thermal Shutdown
Thermal shutdown is employed to protect the device from damage should the die temperature exceed safe margins due
mainly to short circuit faults. Each channel employs its own thermal sensor. Thermal shutdown shuts off the output
MOSFET and asserts the FLG output if the die temperature reaches 140
C and the overheated channel is in current
limit. The over channel will be shut off. Upon determining a thermal shutdown condition. The TS2026 will automatically
reset its output when the die temperature cools down to 120
C . The TS2026 output and FLG signal will continue to
cycle on and off until the device is disabled or the fault is removed. Figure 1. Depicts typical timing. Depending on PCB
layout, package, ambient temperature, etc., it may take several hundred milliseconds from the incidence of the fault to
the output MOSFET being shut off. This time will be shortest in the case of dead short on the output.
Power Dissipation
The device’s junction temperature depends on several factors such as the load, PCB layout, ambient temperature and
package type. Equations that can be used to calculate power dissipation of each channel and junction temperature are
found below.
P
D
= R
DS(ON)
x I
OUT
Total power dissipation of the device will be the summation of PD for both channels. To relate this to junction
temperature, the following equation can be used:
T
J
= P
D
x
θ
JA
+ T
A
Where:
T
J
= junction temperature
T
A
= ambient temperature
θ
JA
= is the thermal resistance of the package
Current Sensing and Limiting
The current-limit threshold is preset internally. The preset level prevents damage to the device and external load but still
allows a minimum current of 500mA to be delivered to the load. The current-limit circuit senses a portion of the output
MOSFET switch current. The current-sense resistor shown in the block diagram is virtual and has no voltage drop. The
reaction to an over current condition varies with three scenarios.
Switch Enable into Short-Circuit
If a switch is enabled into a heavy load or short-circuit, the switch immediately enters into a constant-current mode,
reducing the output voltage. The FLG signal is asserted indicating an over current condition.
Switch Enable Applied to Enabled Output
When a heavy load or short-circuit is applied to an enabled switch, a large transient current may flow until the current
limit circuitry responds. Once this occurs the device limits current to less than the short circuit current limit specification.
Current-Limit Response-Ramped Load
The TS2026 current-limit profile exhibits a small fold back effect of about 200mA. Once this current-limit threshold is
exceeded the device switches into a constant current mode. It is important to note that the device will supply current up
to the current-limit threshold
Fault Flag
The FLG signal is an N-channel open-drain MOSFET output. FLG is asserted (active-low) when either an over current
or thermal shutdown condition occurs. In the case of and over current condition, FLG will be asserted only after the flag
response delay time, t
D
, has elapsed. This ensured that FLG is asserted only upon valid over current conditions and that
erroneous error reporting is eliminated. For example, false over current condition can occur during hot plug event when
a highly capacitive load is connected and causes a high transient inrush current that exceeds the current-limit threshold
for up to 1ms. The FLG response delay time t
D
is typically 3ms.
Undervoltage Lockout
Undervolrage lockout (UVLO) prevents the output MOSFET from turning on until VIN exceeds approximately 2.5V.
Undervoltage detection function only when the switch is enabled.
2
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TS2026CS | 制造商:TSC 制造商全称:Taiwan Semiconductor Company, Ltd 功能描述:Dual-Channel Power Distribution Switch |
| TS2026CS RLG | 功能描述:电源开关 IC - USB 1A USB Power Switch dual RoHS:否 制造商:Micrel 电源电压-最小:2.7 V 电源电压-最大:5.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-8 封装:Tube |
| TS2026L | 制造商:TSC 制造商全称:Taiwan Semiconductor Company, Ltd 功能描述:Dual-Channel Power Distribution Switch |
| TS2026LCS | 制造商:TSC 制造商全称:Taiwan Semiconductor Company, Ltd 功能描述:Dual-Channel Power Distribution Switch |
| TS202R | 制造商:TRSYS 制造商全称:Transys Electronics 功能描述:FAST SWITCHIING RECTIFIER(Reverse Voltage - 50 to 1000 Volts, Current - 2.0Ampere) |
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