参数资料
型号: TS272BC
厂商: 意法半导体
英文描述: HIGH SPEED CMOS DUAL OPERATIONAL AMPLIFIERS
中文描述: 高速CMOS双运算放大器
文件页数: 9/9页
文件大小: 216K
代理商: TS272BC
TS272C,I,M
9/9
PACKAGE MECHANICAL DATA
8 PINS - THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
A1
A2
b
c
D
E
E1
e
k
l
L
L1
1.20
0.15
1.05
0.30
0.20
3.10
0.05
0.006
0.041
0.15
0.012
0.122
0.05
0.80
0.19
0.09
2.90
0.01
0.031
0.007
0.003
0.114
1.00
0.039
3.00
6.40
4.40
0.65
0.118
0.252
0.173
0.025
4.30
4.50
0.169
0.177
0.50
0.45
0.60
0.600
1.000
0.75
0.75
0.09
0.018
0.0236
0.024
0.039
0.030
0.030
C
L
L
1
4
8
5
5
L
c
0.25mm
.010 inch
GAGE PLANE
E1
k
L1
E
S
P
A
A2
D
A1
b
8
4
1
PIN 1 IDENTIFICATION
e
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its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
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相关PDF资料
PDF描述
TS272BI HIGH SPEED CMOS DUAL OPERATIONAL AMPLIFIERS
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TS272C HIGH SPEED CMOS DUAL OPERATIONAL AMPLIFIERS
TS272MAD HIGH SPEED CMOS DUAL OPERATIONAL AMPLIFIERS
TS272MAN Binding Post; Color:Red; Contact Plating:Gold; Contact Termination:Screw Terminal; Features:Insulated; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No
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