
RSWPACKAGE
(TOP VIEW)
1
2
5
8
4
9
3
10
6
7
D1+
D2+
D1
–
D2
–
D–
GND
D+
OE
V
CC
S
RSWPACKAGE
(BOTTOMVIEW)
D1+
D1
–
D+
1
2
3
10
4
9
5
8
6
7
D2+
D2
–
GND
D–
S
V
CC
OE
www.ti.com
SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
1
FEATURES
VCC Operation at 3 V and 4.3 V
1.8-V Compatible Control-Pin Inputs
IOFF Supports Partial Power-Down-Mode
Operation
ron = 10 Max
Δron <0.35 Typ
Cio(ON) = 7 pF Typ
Low Power Consumption (1 mA Max)
ESD Performance Tested Per JESD 22
–
6000-V Human-Body Model (HBM)
(A114-B, Class II)
–
1000-V Charged-Device Model (C101)
–
250-V Machine Model (A115-A)
–3-dB Bandwidth = 955 MHz Typ
Packaged in 10-pin TQFN (1.4 mm × 1.8 mm)
APPLICATIONS
Routes Signals for USB 1.0, 1.1, and 2.0
Mobile Industry Processor Interface (MIPI)
Signal Routing
DESCRIPTION/ORDERING INFORMATION
The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in
handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers
with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge
and phase distortion. The device multiplexes differential outputs from a USB host device to one of two
corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at
the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0 (480 Mbps).
Table 1. ORDERING INFORMATION
TA
PACKAGE(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
–40°C to 85°C
TQFN – RSW
Tape and reel
TS3USB30RSWR
L6_
(1)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
(3)
RSW: The actual top-side marking has one additional character that designates the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright 2007–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.