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参数资料
| 型号： | TS472IQT |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, AUDIO PREAMPLIFIER, QCC24 |
| 封装： | 4 X 4 MM, LEAD FREE, QFN-24 |
| 文件页数： | 13/24页 |
| 文件大小： | 622K |
| 代理商： | TS472IQT |
Package mechanical data
TS472
20/24
6
Package mechanical data
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK packages. These packages have a Lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
6.1
Flip-chip package
Figure 43.
TS472 footprint recommendation
Figure 44.
Pin-out (top view)
Pad in Cu 18
μm with Flash NiAu (2-6μm, 0.2μm max.)
150
μm min.
500
μm
50
0μ
m
500
μm
50
0μ
m
Φ=250μm
Φ=400μm typ.
75m min.
100
μm max.
Track
Non Solder mask opening
Φ=340μm min.
Pad in Cu 18
μm with Flash NiAu (2-6μm, 0.2μm max.)
150
μm min.
500
μm
50
0μ
m
500
μm
50
0μ
m
Φ=250μm
Φ=400μm typ.
75m min.
100
μm max.
Track
Non Solder mask opening
Φ=340μm min.
A
C
B
1
2
3
D
IN+
IN-
GND
OUT+
C2
C1
OUTPUT
BIAS
GS
VCC
OUT-
STDBY
BYPASS
A
C
B
1
2
3
D
IN+
IN-
GND
OUT+
C2
C1
OUTPUT
BIAS
GS
VCC
OUT-
STDBY
BYPASS
Balls are underneath
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