![](http://datasheet.mmic.net.cn/130000/TSDC4872IJT_datasheet_5023247/TSDC4872IJT_29.png)
Obsolete
Product(s)
- Obsolete
Product(s)
TS4872
29/29
NO
T
F
O
R
NEW
D
E
SIGN
PIN OUT (top view)
MARKING (top view)
PACKAGE MECHANICAL DATA
FLIP CHIP - 8 BUMPS
12
3
76
5
8
4
GND
BYPASS
Vout2
STDBY
Vcc
Vout1
Vin
+
Vin
■ Balls are underneath
■ Y : Year
■ W : Week with two digits
■ Example : 1254872
■ Die size : (3.02mm±10%) x (1.52mm ±10%)
■ Die height (including bumps) : 540m ±50m
■ Bump height : 140m ±15m (i.e. bump diameter of 185m ±15m)
■ Silicon thickness : 400m±25m
■ Pitch: 500m ±10m and 750m±10m
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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