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FEATURES
APPLICATIONS
SSOP OR VSSOP PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
NC1
COM1
IN2
GND
COM2
IN1
V+
NC2
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND
IN1
COM2
V+
2
3
4
8
7
5
6
IN2
COM1
NC1
NC2
1
DESCRIPTION/ORDERING INFORMATION
TS5A23167
0.9-
DUAL SPST ANALOG SWITCH
5-V/3.3-V 2-CHANNEL ANALOG SWITCH
SCDS195 – MAY 2005
Cell Phones
Isolation in Powered-Off Mode, V+ = 0
PDAs
Low ON-State Resistance (0.9
)
Portable Instrumentation
Control Inputs Are 5.5-V Tolerant
Audio and Video Signal Routing
Low Charge Injection
Low-Voltage Data Acquisition Systems
Low Total Harmonic Distortion (THD)
Communication Circuits
1.65-V to 5.5-V Single-Supply Operation
Modems
Latch-Up Performance Exceeds 100 mA Per
Hard Drives
JESD 78, Class II
Computer Peripherals
ESD Performance Tested Per JESD 22
Wireless Terminals and Peripherals
– 2000-V Human-Body Model(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
The TS5A23167 is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V
to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD)
performance and consumes very low power. These features make this device suitable for portable audio
applications.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar – WCSP (DSBGA)
Tape and reel
TS5A23167YEPR
PACKAGE PREVIEW
0.23-mm Large Bump – YEP
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP
Tape and reel
TS5A23167YZPR
PACKAGE PREVIEW
–40
°C to 85°C
(Pb-free)
SSOP – DCT
Tape and reel
TS5A23167DCTR
PACKAGE PREVIEW
VSSOP – DCU (Pb-free)
Tape and reel
TS5A23167DCUR
JAP_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The acutal top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright 2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.