参数资料
型号: TSL261RD-TR
厂商: AMS-TAOS USA Inc
文件页数: 8/13页
文件大小: 621K
描述: IC IR LIGHT TO VOLT CONV 8-SOIC
标准包装: 1
系列: *
其它名称: TSL261-RD-TRDKR
TSL250RD, TSL251RD, TSL260RD, TSL261RD
LIGHT-TO-VOLTAGE OPTICAL SENSORS
TAOS050K  OCTOBER 2007
7
The LUMENOLOGY r Company
r
r
Copyright E 2007, TAOS Inc.
www.taosinc.com
MECHANICAL DATA
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The photodiode area is typically 1.02 mm
2
 for the TSL250RD and TSL260RD,
and is typically 0.514 mm
2
 for the TSL251RD and TSL261RD.
PACKAGE D
PLASTIC SMALL-OUTLINE
A
1.75
1.35
0.50
0.25
4.00
3.80
6.20
5.80
455
0.88 TYP TOP OF
SENSOR DIE
5.00
4.80
5.3
MAX
1.27
0.41
0.25
0.10
0.25
0.19
DETAIL A
PIN 1
6 y 1.27
0.510
0.330
8 y
j 2.8 TYP 
CLEAR WINDOW
2.12
 + 0.250
3.00 + 0.250
NOTE B
Pb
TOP VIEW
BOTTOM VIEW
SIDE VIEW
END VIEW
PIN 1
NOTES:  A.  All linear dimensions are in millimeters.
B.  The center of the photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
C.  Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D.  This drawing is subject to change without notice.
Figure 10. Package D  Plastic Small Outline IC Packaging Configuration
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