THE CONNOR-WINFIELD CORP.
2111 COMPREHENSIVE DRIVE.
AURORA, IL 60505.
FAX (630) 851-5040.
PHONE (630) 851-4722.
HTTP://WWW.CONWIN.COM
PRODUCT
DA T A
SHEET
CRYSTAL CONTROLLED OSCILLATORS
The Connor-Winfield TTHB402 is
a 5.0V, Surface Mount,
Sinewave, Temperature
Compensated Crystal Oscillator
(TCXO). The TTHB402 is
designed for applications
requiring very tight frequency
stability vs. temperature
characteristics. The TTHB402 is
offered in a surface mount
package for automated
assembly.
1
2
TTHB402 - 20.0MHz
TCXO
SERIES
CENTER
FREQUENCY
FEATURES
DESCRIPTION
ORDERING INFORMATION
5.0V OPERATION
FREQUENCY STABILITY: ±1.0ppm
OVERALL FREQUENCY TOLERANCE:
±4.6ppm
TEMPERATURE RANGE: -10 to 60°C
LOW JITTER <1pS RMS
SURFACE MOUNT PACKAGE
TAPE AND REEL PACKAGING
SURFACE MOUNT 5V SINEWAVE TCXO
TTHB402
Tx116
00
8/31/04
CW 0434
TTHB402
20.0M
Specifications subject to change without notice.
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Copyright 2001 Connor-Winfield all rights reserved.
a
ABSOLUTE MAXIMUM RATINGS
TABLE 1.0
PARAMETER
UNITS
MINIMUM
NOMINAL
MAXIMUM
UNITS
NOTE
Storage Temperature
-40
-
85
°C
Supply Voltage
(Vcc)
-0.5
-
15
Vdc
OPERATING SPECIFICATIONS
TABLE 2.0
PARAMETER
MINIMUM
NOMINAL
MAXIMUM
UNITS
NOTE
Frequency Range
(Fo)
12.8
-
100
MHz
Frequency Calibration @ 25°C
-1.0
-
1.0
ppm
Frequency Stability vs. Temperature
-1.0
-
1.0
ppm
Aging first year
-1.0
-
1.0
ppm
Aging ten years (includes first year aging)
-2.6
-
2.6
ppm
Total Frequency Tolerance
-4.6
-
4.6
ppm
1
Operating Temperature Range
-10
-
60
°C
Supply Voltage
(Vcc)
4.75
5.00
5.25
Vdc
Supply Current
(Icc)
-
10
mA
Jitter (BW=10Hz to 20MHz)
-
5
ps rms
Jitter (BW=12kHz to 20MHz)
-
1
ps rms
SSB Phase Noise at 10Hz offset
-
-70
-
dBc/Hz
SSB Phase Noise at 100Hz offset
-
-100
-
dBc/Hz
SSB Phase Noise at 1KHz offset
-
-125
-
dBc/Hz
SSB Phase Noise at 10KHz offset
-
-135
-
dBc/Hz
SSB Phase Noise at 100KHz offset
-
-140
-
dBc/Hz
SINEWAVE OUTPUT CHARACTERISTICS
TABLE 3.0
PARAMETER
MINIMUM
NOMINAL
MAXIMUM
UNITS
NOTE
LOAD
-
50
Ohm
Output Power
3
6.5
10
dBm
Harmonics
-
-25
dB
Spurious
-
-75
dB
PROCESS RECOMMENDATIONS
TABLE 5.0
Solder Reflow
The component solder used internal to this device has a m elting point of
221
°C. The peak temperature inside the device should be less t han or
equal to 220
°C for a maximum of 10 seconds
Wash
Ultrasonic cleaning is not recommended.
Note:
1) Inclusive of calibration, frequency vs. temperature stability, supply voltage change, load change,
shock and vibration and aging for ten years.
PACKAGE CHARACTERISTICS
TABLE 4.0
Package
Non-hermetic package consisting of an FR4 substrate with grounded metal
cover.