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5.2

Designing With PowerPAD

t Devices

The TVP5146 device is housed in a high-performance, thermally enhanced, 80-terminal PowerPAD package (TI

package designator: 80PFP). Use of the PowerPAD package does not require any special considerations except to

note that the thermal pad, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical

conductor. Therefore, if not implementing the PowerPAD PCB features, the use of solder masks (or other assembly

techniques) may be required to prevent any inadvertent shorting by the exposed thermal pad of connection etches

or vias under the package. The recommended option, however, is not to run any etches or signal vias under the

device, but to have only a grounded thermal land as explained in the following paragraphs. Although the actual size

of the exposed die pad may vary, the minimum size required for the keep-out area for the 80-terminal PFP PowerPAD

package is 8 mm

× 8 mm.

It is recommended that there be a thermal land, which is an area of solder-tinned copper, underneath the PowerPAD

package. The thermal land varies in size, depending on the PowerPAD package being used, the PCB construction,

and the amount of heat that needs to be removed. In addition, the thermal land may or may not contain numerous

thermal vias depending on PCB construction.

Other requirements for using thermal lands and thermal vias are detailed in the PowerPAD

t Thermally Enhanced

Package technical brief, TI literature number SLMA002, available via the TI Web pages at URL http://www.ti.com.

For the TVP5146 device, this thermal land must be grounded to the low-impedance ground plane of the device. This

improves not only thermal performance but also the electrical grounding of the device. It is also recommended that

the device ground terminal landing pads be connected directly to the grounded thermal land. The land size must be

as large as possible without shorting device signal terminals. The thermal land may be soldered to the exposed

thermal pad using standard reflow soldering techniques.

While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is

recommended that the thermal land be connected to the low impedance ground plane for the device. More

information can be obtained from the TI Recommendations for PHY Layout applicaton report, TI literature number

SLLA020.

PowerPAD is a trademark of Texas Instruments.

相关代理商/技术参数	参数描述
TVP5146M1PFPG4	功能描述:IC VIDEO DECODER 10BIT 80TQFP-EP RoHS:是类别:集成电路 (IC) >> 接口 - 编码器，解码器，转换器系列:- 产品变化通告:Development Systems Discontinuation 26/Apr/2011 标准包装:1 系列:- 类型:编码器应用:DVB-S.2 系统电压 - 电源，模拟:- 电压 - 电源，数字:- 安装类型:- 封装/外壳:模块供应商设备封装:模块包装:散装其它名称:Q4645799
TVP5146M1PFPR	功能描述:视频 IC 10-Bit Digital Video Decoder RoHS:否制造商:Fairchild Semiconductor 工作电源电压:5 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-28 封装:Reel
TVP5146M1PFPRG4	功能描述:视频 IC 10-Bit Digital Video Decoder RoHS:否制造商:Fairchild Semiconductor 工作电源电压:5 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-28 封装:Reel
TVP5146M2	制造商:Texas Instruments 功能描述:4x10-bit Video Decoder TVP5146M2PFP
TVP5146M2IPFP	功能描述:视频 IC 10B Hi Qual Sgl-Chip Dig Video Decoder RoHS:否制造商:Fairchild Semiconductor 工作电源电压:5 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-28 封装:Reel

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