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参数资料
| 型号： | TVP5146PFPR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 颜色信号转换 |
| 英文描述： | COLOR SIGNAL DECODER, PQFP80 |
| 封装： | GREEN, PLASTIC, HTQFP-80 |
| 文件页数： | 5/109页 |
| 文件大小： | 1658K |
| 代理商： | TVP5146PFPR |
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94
SLES084C August 2007
TVP5146
5.2
Designing With PowerPAD
t Devices
The TVP5146 device is housed in a high-performance, thermally enhanced, 80-terminal
PowerPAD package (TI package designator: 80PFP). Use of the PowerPAD package does not
require any special considerations except to note that the thermal pad, which is an exposed die
pad on the bottom of the device, is a metallic thermal and electrical conductor. Therefore, if not
implementing the PowerPAD PCB features, the use of solder masks (or other assembly
techniques) may be required to prevent any inadvertent shorting by the exposed thermal pad of
connection etches or vias under the package. The recommended option, however, is not to run
any etches or signal vias under the device, but to have only a grounded thermal land as
explained in the following paragraphs. Although the actual size of the exposed die pad may vary,
the minimum size required for the keep-out area for the 80-terminal PFP PowerPAD package is
8 mm
× 8 mm.
It is recommended that there be a thermal land, which is an area of solder-tinned copper,
underneath the PowerPAD package. The thermal land varies in size, depending on the
PowerPAD package being used, the PCB construction, and the amount of heat that needs to be
removed. In addition, the thermal land may or may not contain numerous thermal vias
depending on PCB construction.
Other requirements for using thermal lands and thermal vias are detailed in the PowerPAD
t
Thermally Enhanced Package technical brief, TI literature number SLMA002, available via the TI
Web pages at URL http://www.ti.com.
For the TVP5146 device, this thermal land must be grounded to the low-impedance ground
plane of the device. This improves not only thermal performance but also the electrical
grounding of the device. It is also recommended that the device ground terminal landing pads be
connected directly to the grounded thermal land. The land size must be as large as possible
without shorting device signal terminals. The thermal land may be soldered to the exposed
thermal pad using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external
heat sink, it is recommended that the thermal land be connected to the low impedance ground
plane for the device. More information can be obtained from the TI Recommendations for PHY
Layout applicaton report, TI literature number SLLA020.
PowerPAD is a trademark of Texas Instruments.
相关PDF资料 |
PDF描述 |
|---|---|
| TVP5146PFPG4 | COLOR SIGNAL DECODER, PQFP80 |
| TVP5147M1PFPG4 | COLOR SIGNAL DECODER, PQFP80 |
| TVP5147M1PFPRG4 | COLOR SIGNAL DECODER, PQFP80 |
| TVP5147M1PFP | COLOR SIGNAL DECODER, PQFP80 |
| TVP5147M1PFPR | COLOR SIGNAL DECODER, PQFP80 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TVP5147EVM | 功能描述:视频 IC 开发工具 TVP5147 Eval Mod RoHS:否 制造商:Texas Instruments 产品:Evaluation Boards 类型:YPbPr to RGBHV Converters 工具用于评估:LMH1251 工作电源电压:5 V |
| TVP5147M1 | 制造商:TI 制造商全称:Texas Instruments 功能描述:NTSC/PAL/SECAM 2x10-Bit Digital Video Decoder With Macrovision Detection, YPbPr Inputs, and 5-Line Comb Felter |
| TVP5147M1_08 | 制造商:TI 制造商全称:Texas Instruments 功能描述:NTSC/PAL/SECAM 2x10-Bit Digital Video Decoder With Macrovision Detection, YPbPr Inputs, and 5-Line Comb Felter |
| TVP5147M1IPFP | 功能描述:视频 IC 10B Hi Qual Sgl-Chip Dig Video Decoder RoHS:否 制造商:Fairchild Semiconductor 工作电源电压:5 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-28 封装:Reel |
| TVP5147M1IPFPR | 功能描述:视频 IC 10B Hi Qual Sgl-Chip Dig Video Decoder RoHS:否 制造商:Fairchild Semiconductor 工作电源电压:5 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-28 封装:Reel |
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