参数资料
型号: TZA3000HL
厂商: NXP SEMICONDUCTORS
元件分类: 数字传输电路
英文描述: SDH/SONET STM4/OC12 optical receiver
中文描述: RECEIVER, PQFP32
文件页数: 6/20页
文件大小: 498K
代理商: TZA3000HL
1997 Oct 17
6
Philips Semiconductors
Objective specification
SDH/SONET STM4/OC12 optical receiver
TZA3000
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
SYMBOL
PAD
COORDINATES
(1)
x
y
AGND
V
CCA
AGND
DREF
V
CCA
AGND
IPhoto
AGND
AGND
BWC
V
ref
SUB
DGND
RFTEST
OUTSEL
DGND
V
CCD
OUTCML
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
102
102
102
102
102
102
102
102
243
383
523
663
803
943
1100
1257
1398
1398
1251
1111
971
814
674
534
395
254
105
105
105
105
105
105
105
105
263
403
Note
1.
All coordinates are referenced, in
μ
m, to the bottom
left-hand corner of the die.
OUTQCML
V
CCD
DGND
OUTPECL
OUTQPECL
DGND
DGND
LOS
LOSQ
LOSTTL
LOSTH
AGND
AGC
AGND
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1398
1398
1398
1398
1398
1398
1283
1143
986
829
671
514
357
217
543
683
823
963
1103
1243
1400
1400
1400
1400
1400
1400
1400
1400
SYMBOL
PAD
COORDINATES
(1)
x
y
Fig.3 Bonding pad locations: TZA3000U.
handbook, full pagewidth
AGND
1
DGND
24
OUTQPECL
23
OUTPECL
22
DGND
21
VCCD
20
OUTQCML
19
OUTCML
18
VCCD
17
AGND
3
DREF
4
VCCA
5
AGND
6
IPhoto
7
AGND
8
VCCA
2
TZA3000U
9
A
32
A
31
A
30
A
29
L
28
L
27
L
26
L
25
D
10
B
11
V
12
S
13
D
14
R
15
O
16
D
MGK882
y
1.58 mm
x
0
0
1.58
mm
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TZA3000U SDH/SONET STM4/OC12 optical receiver
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