参数资料
型号: UA78M08CDCYG3
厂商: TEXAS INSTRUMENTS INC
元件分类: 固定正电压单路输出标准稳压器
英文描述: 8 V FIXED POSITIVE REGULATOR, PDSO4
封装: GREEN, PLASTIC, SOT-223, 4 PIN
文件页数: 16/21页
文件大小: 560K
代理商: UA78M08CDCYG3
uA78M00 SERIES
SLVS059Q – JUNE 1976 – REVISED APRIL 2010
www.ti.com
Absolute Maximum Ratings
(1)
over virtual junction temperature range (unless otherwise noted)
MIN
MAX
UNIT
VI
Input voltage
35
V
TJ
Operating virtual junction temperature
150
°C
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Package Thermal Data
(1)
PACKAGE
BOARD
qJP
(2)
qJC
qJA
PowerFLEX/TO-252 – KTP
High K, JESD 51-5
1.4°C/W
19°C/W
28°C/W
SOT-223 – DCY
High K, JESD 51-7
30.6°C/W
53°C/W
TO-220 – KC
High K, JESD 51-5
3°C/W
17°C/W
19°C/W
TO-220 – KCS
High K, JESD 51-5
3°C/W
17°C/W
19°C/W
TO-252 – KVU
High K, JESD 51-5
30.3°C/W
(1)
Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/qJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(2)
For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX, qJP is defined as the thermal resistance between
the die junction and the bottom of the exposed pad.
Recommended Operating Conditions
MIN
MAX
UNIT
uA78M33
5.3
25
uA78M05
7
25
uA78M06
8
25
uA78M08
10.5
25
VI
Input voltage
V
uA78M09
11.5
26
uA78M10
12.5
28
uA78M12
14.5
30
uA78M15
17.5
30
IO
Output current
500
mA
uA78MxxC
0
125
TJ
Operating virtual junction temperature
°C
uA78MxxI
–40
125
4
Copyright 1976–2010, Texas Instruments Incorporated
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