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| 型号： | UCLAMP3324P.TCT |
| 厂商： | Semtech |
| 文件页数： | 1/6页 |
| 文件大小： | 0K |
| 描述： | TVS ARRAY UCLAMP 3.3V 8-SLP |
| 标准包装： | 1 |
| 系列： | uClamp™ |
| 电压 - 反向隔离（标准值）： | 3.3V |
| 功率（瓦特）： | 40W |
| 电极标记： | 4 通道阵列 - 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-UFDFN 裸露焊盘 |
| 供应商设备封装： | SLP2116P8（2.1x1.6） |
| 包装： | 标准包装 |
| 产品目录页面： | 1357 (CN2011-ZH PDF) |
| 其它名称： | UCLAMP3324PDKR |
uClamp3324P
Low Voltage TVS
for ESD Protection
PROTECTION PRODUCTS - MicroClamp TM
The μClamp series of TVS arrays are designed to
Description
TM
protect sensitive electronics from damage or latch-up
due to ESD, lightning, and other voltage-induced
transient events. Each device will protect up to four
lines operating at 3.3 volts .
The μClamp TM 3324P is a solid-state device designed
specifically for transient suppression. It is constructed
using Semtech’s proprietary EPD process technology.
The EPD process provides low standoff voltages with
significant reductions in leakage currents and capaci-
tance over traditional pn junction processes. They offer
desirable characteristics for board level protection
including fast response time, low clamping voltage and
no device degradation.
The μClamp3324P may be used to meet the immunity
requirements of IEC 61000-4-2, level 4 (±15kV air,
±8kV contact discharge). The “flow-thru” design of the
device results in enhanced ESD performance due to
reduced board trace inductance. The result is lower
clamping voltage and a higher level of protection when
compared to conventional TVS devices.
The μClamp3324P is in an 8-pin, RoHs compliant,
SLP2116P8 package. It measures 2.1 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and notebook
computers.
Circuit Diagram
Features
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Small package for use in portable electronics
Protects four I/O
Working voltage: 3.3V
Flow thru design for easy layout
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP2116P8 package
RoHs Compliant
Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead Finish: NiPd
Marking : Orientation Mark and Marking Code
Packaging : Tape and Reel per EIA 481
Applications
Cellular Handsets & Accessories
Personal Digital Assistants (PDA’s)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Package
1
8
2
7
3
6
4
5
2.10
1 2
1.60
0.50 BSC
0.58
GND
Device Schematic
8 Pin SLP package (Bottom Side View)
2.1 x 1.6 x 0.58mm (Nominal)
Revision 01/05/2005
1
www.semtech.com
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