参数资料
型号: UMK212B7224MG-T
厂商: Taiyo Yuden
文件页数: 14/28页
文件大小: 0K
描述: CAP CER 0.22UF 50V 20% X7R 0805
产品变化通告: X5R, X7R Part Number Change
标准包装: 3,000
系列: M
电容: 0.22µF
电压 - 额定: 50V
容差: ±20%
温度系数: X7R
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 125°C
应用: 通用
封装/外壳: 0805(2012 公制)
尺寸/尺寸: 0.079" L x 0.049" W(2.00mm x 1.25mm)
厚度(最大): 0.053"(1.35mm)
包装: 带卷 (TR)
其它名称: CE UMK212 B7224MG-T
UMK212BJ224MG-T
UMK212BJ224MG-T-ND
Multilayer Ceramic Capacitors
■ PACKAGING
①Minimum Quantity
● Taped package
Type(EIA)
mm
Thickness
code
Standard quantity [pcs]
Paper tape Embossed tape
□MK042(01005)
□VS042(01005)
□MK063(0201)
□WK105(0204) ※
□MK105(0402)
□VK105(0402) ※
□MK107(0603)
□WK107(0306) ※
□MR107(0603)
□MK212(0805)
□WK212(0508) ※
□MR212(0805)
□MK316(1206)
□MR316(1206)
0.2
0.2
0.3
0.3
0.2
0.3
0.5
0.5
0.45
0.5
0.8
0.45
0.85
125
0.85
1.15
125
1.6
C, D
C
P, T
P
C
P
V
W
K
V
A
K
D
G
D
F
G
L
15000
10000
20000
15000
10000
4000
4000
4000
40000
4000
3000
3000
2000
0.85
D
□MK325(1210)
□MR325(1210)
□MK432(1812)
1.15
1.9
2.0max.
2.5
2.5
F
N
Y
M
M
2000
500(T), 1000(P)
500
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
● Card board carrier tape
Top tape
Base tape
Sprocket hole
● Embossed tape
Top tape
Sprocket hole
Bottom tape
Chip cavity
Base tape
Chip cavity
Chip filled
Chip
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
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UMK212B7473KG-T 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MLCC 0805 50V X7R 0.047uF 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
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