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参数资料
| 型号： | UP050SL390J-NAC |
| 厂商： | Taiyo Yuden |
| 文件页数： | 25/26页 |
| 文件大小： | 0K |
| 描述： | CAP CER 39PF 50V 5% AXIAL |
| 标准包装： | 1,000 |
| 电容： | 39pF |
| 电压 - 额定： | 50V |
| 容差： | ±5% |
| 温度系数： | SL |
| 安装类型： | 通孔 |
| 工作温度： | -25°C ~ 85°C |
| 应用： | 通用 |
| 封装/外壳： | 轴向 |
| 尺寸/尺寸： | 0.087" 直径 x 0.126" L（2.20mm x 3.20mm） |
| 包装： | 散装 |
◆Selection of Flux
1. When soldering capacitors are on the board, flux should be applied thinly and evenly.
2. Flux used should be with less than or equal to 0.1 wt% (equivalent to Chlorine) of halogenated content. Flux having a strong acidity
content should not be applied.
3. When using water-soluble flux, special care should be taken to properly clean the boards.
◆Wave Soldering
Precautions
Technical
considerations
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions.
2. Do not immerse the entire capacitor in the flux during the soldering operation. Only solder the lead wires on the bottom of the board.
◆Recommended conditions for using a soldering iron:
1. Put the soldering iron on the land-pattern.
Soldering iron's temperature - below 350℃
Duration - 3 seconds or less
Numbers of times - 1 times
The soldering iron should not directly touch the capacitor.
◆Selection of Flux
1. Flux is used to increase solderability in wave soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
2. With too much halogenated substance (Chlorine, etc.) content is used to activate the flux, an excessive amount of residue after soldering
may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors.
3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Wave Soldering
1. If capacitors are used beyond the range of the recommended conditions, heat stresses may cause cracks inside the capacitors, and
consequently degrade the reliability of the capacitors.
2. When the capacitors are dipped in solder, some soldered parts of the capacitor may melt due to solder heat and cause short-circuits or
cracking of the ceramic material. Deterioration of the resin coating may lower insulation resistance and cause a reduction of withstand
voltage.
◆Recommended conditions for using a soldering iron:
1. If products are used beyond the range of the recommended conditions, heat stress may deform the products, and consequently degrade
the reliability of the products.
5. Cleaning
Precautions
Technical
considerations
◆Board cleaning
1. When cleaning the mounted PC boards, make sure that cleaning conditions are consistent with prescribed usage conditions.
1. The resin material used for the outer coating of capacitors is occasionally a wax substance for moisture resistance which can easily be
dissolved by some solutions.
So before cleaning, special care should be taken to test the component’s vulnerability to the solutions used.
When using water-soluble flux please clean the PCB with purified water sufficiently and dry thoroughly at the end of the process.
Insufficient washing or drying could lower the reliability of the capacitors.
6. Post-cleaning-process
◆Application of resin molding, etc. to the PCB and components.
Precautions
Technical
considerations
1. Please contact your local Taiyo Yuden sales office before performing resin coating or molding on mounted capacitors. Please contact
your local Taiyo Yuden sales office in case of sealing the capacitor with resin or molding it on mounted capacitors. Please verify that
the sealing or molding does not affect on the actual application in quality.
1-1. The thermal expansion and coefficient of contraction of the molded resin are not necessarily matched with those of the capacitor. The
capacitors may be exposed to stresses due to thermal expansion and contraction during and after hardening. This may lower the
specified characteristics and insulation resistance or cause reduced withstanding voltage by cracking the ceramic or separating the
coated resin from the ceramics.
1-2. With some types of mold resins, the resin's decomposition gas or reaction gas may remain inside the resin during the hardening period or
while left under normal conditions, cause a deterioration of the capacitor's performance.
1-3. Some mold resins may have poor moisture proofing properties. Please verify the contents of the resins before they are applied.
1-4. Please contact Taiyo Yuden before using if the hardening process temperature of the mold resins is higher than the operating
temperature of the capacitors.
7. Handling
◆Mechanical considerations
Precautions
Technical
considerations
1. Be careful not to subject the capacitors to excessive mechanical shocks. Withstanding voltage failure may result.
2. If ceramic capacitors are dropped onto the floor or a hard surface they should not be used.
1. Because the capacitor is made of ceramic, mechanical shocks applied to the board may damage or crack the capacitors.
2. Ceramic capacitors which are dropped onto the floor or a hard surface may develop defects and have a higher risk of failure over time.
8. Storage conditions
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_leaded_prec_e-E02R01
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