参数资料
型号: UPB1513TU-E2-A
厂商: CEL
文件页数: 10/13页
文件大小: 0K
描述: MMIC PRESCALER 13GHZ 8-MINIMOLD
产品变化通告: Product Obsolescence 25/Oct/2011
标准包装: 5,000
功能: 预定标器
频率: 5GHz ~ 13GHz
RF 型: VSAT,DBS
次要属性: 4 分型
封装/外壳: 8-SMD
包装: 带卷 (TR)
μ PB1513TU
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground terminals as short as possible.
(4) Bypass capacitance must be attached to V CC line.
(5) Exposed heatsink at bottom on package must be soldered to PCB RF/DC ground.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Wave Soldering
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
: 260 ° C or below
: 10 seconds or less
: 60 seconds or less
: 120 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ° C or below
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120 ° C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 1 time
: 0.2%(Wt.) or below
Partial Heating
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
10
Data Sheet PU10540EJ02V0DS
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