参数资料
型号: UPC2791TB
元件分类: 放大器
英文描述: 1900 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封装: SUPER MINIMOLD, 6 PIN
文件页数: 9/20页
文件大小: 189K
代理商: UPC2791TB
Data Sheet P11863EJ3V0DS
17
PC2791TB, PC2792TB
NOTES ON CORRECT USE
(1) Observe precautions for handiling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The DC cut capacitor must be each attached to input pin and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions.
For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235° C or below
Time: 30 seconds or less (at 210° C)
Count: 3, Exposure limit: None
Note
IR35-00-3
VPS
Package peak temperature: 215° C or below
Time: 40 seconds or less (at 200° C)
Count: 3, Exposure limit: None
Note
VP15-00-3
Wave Soldering
Soldering bath temperature: 260° C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Note
WS60-00-1
Partial Heating
Pin temperature: 300° C or below
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
Note After opening the dry pack, keep it in a place below 25° C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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