参数资料
型号: UPC2907T
元件分类: 固定正电压单路输出LDO稳压器
英文描述: 7 V FIXED POSITIVE LDO REGULATOR, 1 V DROPOUT, PSSO2
封装: SC-63, 3 PIN
文件页数: 14/23页
文件大小: 284K
代理商: UPC2907T
PC29xx Series
19
Data Sheet G10026EJ4V0DS
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our
sales offices.
For more details, refer to the Semiconductor Device Mount Manual
(http://www.necel.com/pkg/en/mount/index.html)
Surface mount devices
PC29xxT Series: SC-63 (MP-3Z)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°C or below (Package surface temperature),
IR35-00-3
Reflow time: 30 seconds or less (at 210
°C or higher),
Maximum number of reflow processes: 3 times or less.
VPS
Peak temperature: 215
°C or below (Package surface temperature),
VP15-00-3
Reflow time: 40 seconds or less (at 200
°C or higher),
Maximum number of reflow processes: 3 times or less.
Partial heating method
Pin temperature: 350
°C or below,
P350
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
Remark Flux: Rosin-based flux sith low chlorine content (chlorine 0.2 Wt% or below) is recommended.
PC29xxT-AZ Series Note1, PC29xxT-AY Series Note2: SC-63 (MP-3Z)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 260
°C or below (Package surface temperature),
IR60-00-3
Reflow time: 60 seconds or less (at 220
°C or higher),
Maximum number of reflow processes: 3 times or less.
Partial heating method
Pin temperature: 350
°C or below,
P350
Heat time: 3 seconds or less (Per each side of the device).
Notes 1. Pb-free (This product does not contain Pb in the external electrode.)
2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
Remark Flux: Rosin-based flux sith low chlorine content (chlorine 0.2 Wt% or below) is recommended.
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