参数资料
| 型号： | UPC3221GV-E1-A |
| 厂商： | CEL |
| 文件页数： | 8/16页 |
| 文件大小： | 0K |
| 描述： | IC AGC AMPLIFIER 8-SSOP |
| 标准包装： | 1,000 |
| 应用： | 自动增益控制（AGC） |
| 输出类型： | 差分 |
| 电路数： | 1 |
| -3db带宽： | 100MHz |
| 电流 - 电源： | 33mA |
| 电压 - 电源，单路/双路(±)： | 4.5 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-LSSOP（0.126"，3.20mm 宽） |
| 供应商设备封装： | 8-SSOP |
| 包装： | 带卷 (TR) |
14
Data Sheet PU10171EJ03V0DS
PC3221GV
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
: 260
C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220
C or higher
: 60 seconds or less
Preheating time at 120 to 180
C
: 120
30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature)
: 215
C or below
Time at temperature of 200
C or higher
: 25 to 40 seconds
Preheating time at 120 to 150
C
: 30 to 60 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature)
: 260
C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature)
: 120
C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
: 350
C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
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相关代理商/技术参数 |
参数描述 |
|---|---|
| UPC3221GV-EVAL | 功能描述:放大器 IC 开发工具 For UPC3221GV-A RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
| UPC3223TB | 制造商:CEL 制造商全称:CEL 功能描述:BIPOLAR ANALOG INTEGRATED CIRCUIT |
| UPC3223TB-A | 功能描述:射频放大器 Medium Output Power RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| UPC3223TB-E3 | 制造商:CEL 制造商全称:CEL 功能描述:5 V, SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER |
| UPC3223TB-E3-A | 功能描述:射频放大器 Medium Output Power RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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