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参数资料
| 型号： | UPC3225TB-A |
| 厂商： | CEL |
| 文件页数： | 15/15页 |
| 文件大小： | 0K |
| 描述： | IC MMIC AMP 6-SUPER MINIMOLD |
| 产品目录绘图： | NE69, UP Series |
| 标准包装： | 1 |
| 频率： | 2.8GHz ~ 3.2GHz |
| 增益： | 32.5dB |
| 噪音数据： | 3.7dB |
| RF 型： | DBS |
| 电源电压： | 4.5 V ~ 5.5 V |
| 电流 - 电源： | 24.5mA |
| 封装/外壳： | 6-TSSOP，SC-88，SOT-363 |
| 包装： | 散装 |
| 产品目录页面： | 578 (CN2011-ZH PDF) |
UPC3225TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the V CC pin.
(4) The inductor (L) must be attached between V CC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Wave Soldering
Partial Heating
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ? C or higher
Preheating time at 120 to 180 ? C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260 ? C or below
: 10 seconds or less
: 60 seconds or less
: 120 ? 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ? C or below
: 10 seconds or less
: 120 ? C or below
: 1 time
: 0.2%(Wt.) or below
: 350 ? C or below
: 3 seconds or less
: 0.2%(Wt.) or below
IR260
WS260
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10500EJ01V0DS
15
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相关代理商/技术参数 |
参数描述 |
|---|---|
| UPC3225TB-E3 | 制造商:CEL 制造商全称:CEL 功能描述:BIPOLAR ANALOG INTEGRATED CIRCUIT |
| UPC3225TB-E3-A | 功能描述:射频放大器 Medium Output Power RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| UPC3226TB | 制造商:CEL 制造商全称:CEL 功能描述:BIPOLAR ANALOG INTEGRATED CIRCUIT |
| UPC3226TB-A | 功能描述:射频放大器 Medium Output Power RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| UPC3226TB-E3 | 制造商:NEC 制造商全称:NEC 功能描述:5 V, SILICON GERMANIUM MMIC MEDIUM OUTPUT POWER AMPLIFIER |
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