参数资料
型号: UPC3241TB-A
厂商: CEL
文件页数: 18/18页
文件大小: 0K
描述: MMIC AMPLIFIER 6 PIN MINIMOLD
标准包装: 1
频率: 250MHz ~ 3GHz
P1dB: 6dBm
增益: 24dB
噪音数据: 4.3dB
RF 型: DBS,L 频段,IF 卫星
电源电压: 3 V ~ 3.6 V
电流 - 电源: 19.8mA
测试频率: 2.2GHz
封装/外壳: 6-TSSOP,SC-88,SOT-363
包装: 散装
? PC3241TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the V CC line.
(4) The inductor (L) must be attached between V CC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Wave Soldering
Partial Heating
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ? C or higher
Preheating time at 120 to 180 ? C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260 ? C or below
: 10 seconds or less
: 60 seconds or less
: 120 ? 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ? C or below
: 10 seconds or less
: 120 ? C or below
: 1 time
: 0.2%(Wt.) or below
: 350 ? C or below
: 3 seconds or less
: 0.2%(Wt.) or below
IR260
WS260
HS350
Caution Do not use different soldering methods together (except for partial heating).
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