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参数资料
| 型号： | UPG2012TB-A |
| 厂商： | CEL |
| 文件页数： | 7/8页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH SPDT 6-SMINI |
| 产品目录绘图： | NE69, UP Series |
| 标准包装： | 1 |
| RF 型： | 802.15.1/Bluetooth，手机，PCS，WLAN，WLL |
| 频率： | 500MHz ~ 2.5GHz |
| 特点： | SPDT |
| 封装/外壳： | 6-TSSOP，SC-88，SOT-363 |
| 供应商设备封装： | 6-SuperMiniMold |
| 包装： | 散装 |
| 产品目录页面： | 577 (CN2011-ZH PDF) |
? PG2012TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ? C or higher
Preheating time at 120 to 180 ? C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200 ? C or higher
Preheating time at 120 to 150 ? C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260 ? C or below
: 10 seconds or less
: 60 seconds or less
: 120 ? 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215 ? C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ? C or below
: 10 seconds or less
: 120 ? C or below
: 1 time
: 0.2%(Wt.) or below
: 350 ? C or below
: 3 seconds or less
: 0.2%(Wt.) or below
IR260
VP215
WS260
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10218EJ01V0DS
7
相关PDF资料 |
PDF描述 |
|---|---|
| UPG2418TB-A | IC SW SPDT 0.5-3.0GHZ 6-MINIMOLD |
| UPG2159T6R-A | IC SW SPDT .05GHZ-3.0GHZ 6TSSON |
| UPG2406T6R-A | IC SW SPDT 6-TSSON |
| UPG2408TK-A | IC SPDT 6-MINIMOLD |
| UPG2406TK-A | IC SPDT 6-MINIMOLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| UPG2012TB-E3 | 功能描述:RF 开关 IC L S Band SPDT Switch RoHS:否 制造商:M/A-COM Technology Solutions 开关数量:Single 开关配置:SPDT 介入损耗:0.6 dB 截止隔离（典型值）:43 dB 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PQFN-16 封装:Reel |
| UPG2012TB-E3-A | 功能描述:RF 开关 IC L S Band SPDT Switch RoHS:否 制造商:M/A-COM Technology Solutions 开关数量:Single 开关配置:SPDT 介入损耗:0.6 dB 截止隔离（典型值）:43 dB 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PQFN-16 封装:Reel |
| UPG2012TB-EVAL | 功能描述:射频开发工具 For UPG2012TB-A RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| UPG2012TB-EVAL-A | 功能描述:射频开发工具 For UPG2012TB-A RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| UPG2012TK | 功能描述:RF 开关 IC SPDT Single Switch RoHS:否 制造商:M/A-COM Technology Solutions 开关数量:Single 开关配置:SPDT 介入损耗:0.6 dB 截止隔离（典型值）:43 dB 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PQFN-16 封装:Reel |
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