参数资料
型号: UPG2151T5K-A
厂商: CEL
文件页数: 9/10页
文件大小: 0K
描述: IC SWITCH SPDT 6-TSSON
标准包装: 1
RF 型: 手机,CDMA,GPS,PCS
频率: 50MHz ~ 3GHz
特点: SPDT
封装/外壳: 6-XFDFN 裸露焊盘
供应商设备封装: 6-TSSON
包装: 散装
μ PG2151T5K
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Wave Soldering
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
: 260 ° C or below
: 10 seconds or less
: 60 seconds or less
: 120 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ° C or below
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120 ° C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 1 time
: 0.2%(Wt.) or below
Partial Heating
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10574EJ02V0DS
9
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