参数资料
型号: UPG2179TB-E4-A
厂商: CEL
文件页数: 9/11页
文件大小: 0K
描述: IC SWITCH SPDT 6-SMINI
标准包装: 3,000
RF 型: 802.11a/b/g/Wi-Fi,802.16/WiMax,WLAN
频率: 500MHz ~ 3GHz
特点: SPDT
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: 6-SuperMiniMold
包装: 带卷 (TR)
μ PG2179TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
S o l d e r i n g M e t h o d
S o l d e r i n g C o n d i t i o n s
C o n d i t i o n S y m b o l
Infrared Reflow
V P S
Peak temperature (package surface temperature)
T i m e a t p e a k t e m p e r a t u r e
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
P e a k t e m p e r a t u r e ( p a c k a g e s u r f a c e t e m p e r a t u r e )
Time at temperature of 200 ° C or higher
Preheating time at 120 to 150 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260 ° C or below
: 1 0 s e c o n d s o r l e s s
: 60 seconds or less
: 1 2 0 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 2 1 5 ° C or below
: 25 to 40 seconds
: 3 0 t o 6 0 s e c o n d s
: 3 times
: 0.2%(Wt.) or below
IR260
VP215
Wave Soldering
Peak temperature (molten solder temperature) : 260 ° C or below
T i m e a t p e a k t e m p e r a t u r e : 1 0 s e c o n d s o r l e s s
Preheating temperature (package surface temperature) : 120 ° C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass)       : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10454EJ02V0DS
9
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