参数资料
型号: UPG2214TB-EVAL
厂商: CEL
文件页数: 11/13页
文件大小: 0K
描述: EVAL BOARD FOR UPG2214TB
标准包装: 1
类型: RFIC 开关
适用于相关产品: UPG2214TB
所含物品:
A Business Partner of Renesas Electronics Corporation.
PG2214TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods
and conditions other than those recommended below, contact your nearby sales office.
S o l d e r i n g M e t h o d
S o l d e r i n g C o n d i t i o n s
C o n d i t i o n S y m b o l
Infrared Reflow
V P S
Peak temperature (package surface temperature)
T i m e a t p e a k t e m p e r a t u r e
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
P e a k t e m p e r a t u r e ( p a c k a g e s u r f a c e t e m p e r a t u r e )
Time at temperature of 200 ° C or higher
Preheating time at 120 to 150 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260 ° C or below
: 1 0 s e c o n d s o r l e s s
: 60 seconds or less
: 1 2 0 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 2 1 5 ° C or below
: 25 to 40 seconds
: 3 0 t o 6 0 s e c o n d s
: 3 times
: 0.2%(Wt.) or below
IR260
VP215
Wave Soldering
Peak temperature (molten solder temperature) : 260 ° C or below
T i m e a t p e a k t e m p e r a t u r e : 1 0 s e c o n d s o r l e s s
Preheating temperature (package surface temperature) : 120 ° C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass)       : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
R 0 9 D S 0 0 5 0 E J 0 4 0 0 R e v . 4 . 0 0
Sep 10, 2012
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