参数资料
型号: UPG2214TK-A
厂商: CEL
文件页数: 11/12页
文件大小: 0K
描述: IC SWITCH SPDT 6-MINIMOLD
产品目录绘图: NE69, UP Series
标准包装: 1
RF 型: 802.11a/b/g/Wi-Fi,802.16/WiMax,WLAN
频率: 50MHz ~ 3GHz
特点: SPDT
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: 6-SuperMiniMold
包装: 散装
产品目录页面: 577 (CN2011-ZH PDF)
? PG2214TK
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ? C or higher
Preheating time at 120 to 180 ? C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200 ? C or higher
Preheating time at 120 to 150 ? C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260 ? C or below
: 10 seconds or less
: 60 seconds or less
: 120 ? 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215 ? C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ? C or below
: 10 seconds or less
: 120 ? C or below
: 1 time
: 0.2%(Wt.) or below
: 350 ? C or below
: 3 seconds or less
: 0.2%(Wt.) or below
IR260
VP215
WS260
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10475EJ04V0DS
11
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