参数资料
型号: UPG2250T5N-A
厂商: CEL
文件页数: 9/10页
文件大小: 0K
描述: GAAS MMIC BLUETOOTH-ZIGB 6TSON
产品目录绘图: UPG2314T5N-E2-A
标准包装: 1
频率: 2.4GHz ~ 2.5GHz
RF 型: 蓝牙
电源电压: 1.8 V ~ 3.5 V
电流 - 电源: 130mA
封装/外壳: 6-TSON
包装: 散装
产品目录页面: 578 (CN2011-ZH PDF)
? PG2250T5N
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Wave Soldering
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ? C or higher
Preheating time at 120 to 180 ? C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
: 260 ? C or below
: 10 seconds or less
: 60 seconds or less
: 120 ? 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ? C or below
: 10 seconds or less
: 120 ? C or below
IR260
WS260
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Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Partial Heating Peak temperature (terminal temperature) : 350 ? C or below HS350
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Caution Do not use different soldering methods together (except for partial heating).
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Data Sheet PG10639EJ03V0DS
9
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