参数资料
型号: UPG2413T6M-E2-A
厂商: CEL
文件页数: 11/12页
文件大小: 0K
描述: IC SW SP3T 500MHZ-3GHZ 12-TSQFN
标准包装: 3,000
RF 型: 802.11b/g
频率: 500MHz ~ 3GHz
特点: SP3T
封装/外壳: 12-XFQFN 裸露焊盘
供应商设备封装: 12-TSQFN(2x2)
包装: 带卷 (TR)
? PG2413T6M
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Partial Heating
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ? C or higher
Preheating time at 120 to 180 ? C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260 ? C or below
: 10 seconds or less
: 60 seconds or less
: 120 ? 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 350 ? C or below
: 3 seconds or less
: 0.2%(Wt.) or below
IR260
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10792EJ01V0DS
11
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