参数资料
| 型号： | V048T096T025 |
| 厂商： | Vicor Corporation |
| 文件页数： | 8/11页 |
| 文件大小： | 0K |
| 描述： | VTM CURRENT MULTIPLIER 9.60V 25A |
| 应用说明： | Factorized Power Architecture and V-I Chips |
| 标准包装： | 1 |
| 系列： | V-I Chip™, VTM™ |
| 类型： | 变压模块 |
| 输出数： | 1 |
| 电压 - 输入（最小）： | 32V |
| 电压 - 输入（最大）： | 55V |
| 输出电压： | 9.6V |
| 电流 - 输出（最大）： | 25A |
| 电源（瓦） - 制造商系列： | 240W |
| 电压 - 隔离： | 2.25kV（2250V） |
| 应用： | 商用 |
| 特点： | 具有远程开/关功能 |
| 安装类型： | 通孔 |
| 封装/外壳： | 模块 |
| 尺寸/尺寸： | 1.28" L x 0.87" W x 0.26" H（32.5mm x 22.0mm x 6.7mm） |
| 包装： | 托盘 |
| 工作温度： | -40°C ~ 125°C |
| 效率： | 96.2% |
| 电源（瓦特）- 最大： | 240W |
| 重量： | 0.033 磅（14.97g） |
| 其它名称： | 1102-1165 V048T096T025-ND |
Not Recommended for New Designs - Replaced by VTM48Ex096y025A00
Mechanical Drawings (continued)
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
V048F096T025
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
NOTES:
1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
3. VI CHIP ? MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE VI CHIP PRODUCTS.
TOP SIDE SHOWN
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
5. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = ±0.3 [0.01]
X.XX [X.XXX] = ±0.13 [0.005]
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
Figure 14 — Hole location for push pin heat sink relative to VI Chip ? module
VTM ? Current Multiplier
Page 8 of 11
Rev 2.9
01/2014
vicorpower.com
800 927.9474
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