参数资料
型号: V048T320T009
厂商: Vicor Corporation
文件页数: 8/11页
文件大小: 0K
描述: VTM CURRENT MULTIPLIER 32V 9.40A
应用说明: Factorized Power Architecture and V-I Chips
标准包装: 1
系列: V-I Chip™, VTM™
类型: 变压模块
输出数: 1
电压 - 输入(最小): 26V
电压 - 输入(最大): 55V
输出电压: 32V
电流 - 输出(最大): 9.4A
电源(瓦) - 制造商系列: 300W
电压 - 隔离: 2.25kV(2250V)
应用: 商用
特点: 具有远程开/关功能
安装类型: 通孔
封装/外壳: 模块
尺寸/尺寸: 1.28" L x 0.87" W x 0.26" H(32.5mm x 22.0mm x 6.7mm)
包装: 托盘
工作温度: -40°C ~ 125°C
效率: 96.2%
电源(瓦特)- 最大: 301W
重量: 0.033 磅(14.97g)
其它名称: 1102-1168
V048T320T009-ND
Not Recommended for New Designs - Replaced by VTM48Ex320y009A00
Mechanical Drawings (continued)
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
V048F320T009
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
NOTES:
1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
3. VI CHIP ? MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE VI CHIP PRODUCTS.
TOP SIDE SHOWN
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
5. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = ±0.3 [0.01]
X.XX [X.XXX] = ±0.13 [0.005]
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
Figure 14 — Hole location for push pin heat sink relative to VI Chip ? module
VTM ? Current Multiplier
Page 8 of 11
Rev 2.8
01/2014
vicorpower.com
800 927.9474
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